High-Frequency Module Shield Structure for Uneven Component Heights
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Solution Overview
Problem
The existing high frequency modules require thicker substrates to ensure that lower electronic components make contact with the shield electrode layer, leading to increased costs.
Innovation Solution
A high frequency module design where the metal layer covers both the first and second electronic components, with the first electronic component's main surface away from the mounting substrate in contact with the metal layer, and a resin layer covering the outer surfaces of both components, allowing the first electronic component to be lower in height than the second, thus reducing material usage and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is formed thick to ensure contact between lower electronic components and the shield electrode layer, then electromagnetic shielding performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent transitions from a traditional planar shielding structure to a three-dimensional configuration where the shield electrode layer is folded into multiple surfaces (first surface covering the first electronic component, second surface covering the second electronic component). This dimensional change allows the same substrate area to provide shielding for multiple components at different heights, eliminating the need for substrate thickening while maintaining shielding effectiveness.
Solution Approach 2:
The shield electrode layer is designed to nest around multiple electronic components of different heights within the same module. The first surface extends to cover the lower first electronic component, while the second surface covers the higher second electronic component, creating a nested shielding structure that efficiently protects components at various levels without requiring increased substrate thickness.
2Adaptability or versatility
If the substrate is formed thick to accommodate components of different heights, then component mounting flexibility is improved, but material usage increases
Solution Approach 1:
By folding the shield electrode layer into multiple surfaces extending in different directions, the patent creates a three-dimensional shielding structure that adapts to components of varying heights. This allows the substrate to maintain standard thickness while the shield electrode provides coverage for components at different vertical levels, reducing material usage compared to thick substrate approaches.
Solution Approach 2:
The shield electrode layer is configured with different surface extensions tailored to specific component heights and positions. The first surface extends to cover the lower first electronic component, while the second surface extends to cover the higher second electronic component. This localized adaptation allows the substrate to provide optimal shielding for each component without uniformly increasing thickness across the entire substrate.
3Ease of manufacture
If the first electronic component is made lower in height, then cost is reduced, but contact with the shield electrode layer becomes difficult
Solution Approach 1:
The patent resolves the contact issue by extending the shield electrode layer's first surface downward to reach the lower first electronic component. This vertical extension in the thickness direction ensures reliable electrical contact and electromagnetic shielding for the lower component, allowing cost-effective design with reduced component heights without compromising shielding reliability.
Data Source
AI summary
An increase in cost can be suppressed. A high frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal layer has a ground potential and covers a part of the resin layer. The metal layer overlaps a part of the first electronic component and overlaps a part of the second electronic component in plan view from a thickness direction of the mounting substrate. A height of the first electronic component is lower than a height of the second disposal condition in the thickness direction of the mounting substrate. A part of a main surface of the first electronic component that is far away from the mounting substrate is in contact with the metal layer.