Mixed-Material Phased Array LiDAR Chip for High-Power Light Coupling
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Solution Overview
Problem
Current phased array LiDAR chips using silicon as a substrate face limitations due to silicon's strong nonlinearity, two-photon absorption, and free carrier absorption effects, which restrict high-power light transmission and impair detection performance.
Innovation Solution
A phased array LiDAR transmitting chip of mixed materials is developed, incorporating a first material structure layer with a lower nonlinear refractive index than silicon, optically connected to an SOI silicon waveguide structure layer through a coupling connection structure. This configuration allows for higher optical power input and efficient light division, enabling normal transmission in silicon waveguides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If silicon is used as the substrate material for phased array LiDAR chip, then the basic functions of LiDAR can be realized, but high-power light transmission is limited due to strong nonlinearity, two-photon absorption and free carrier absorption effects
Solution Approach 1:
The chip is divided into two distinct material regions: a first material structure layer for high-power light input and coupling, and an SOI silicon waveguide structure layer for phase modulation and beam steering. This segmentation allows each material to perform its optimal function without suffering from the limitations of the other.
Solution Approach 2:
A coupling connection structure is introduced as an intermediary between the first material structure layer and the SOI silicon waveguide structure layer. This coupling structure facilitates efficient light transfer from the low-loss material to the silicon waveguide, enabling high-power input while maintaining low transmission loss through the silicon portion.
2Power
If high-power light is transmitted in silicon waveguide, then optical power input can be increased, but transmission loss increases due to two-photon absorption and free carrier absorption effects
Solution Approach 1:
The functional segmentation separates the high-power light handling task from the detection task. The first material structure layer handles high-power input with low loss, while the SOI silicon waveguide layer performs phase modulation for detection, ensuring both high power input and reliable detection performance.
Solution Approach 2:
Different material properties are assigned to different regions of the chip. The first material structure layer uses material with properties suitable for high-power transmission, while the silicon waveguide region uses material optimized for phase modulation and detection, achieving local optimization of both power handling and detection quality.
3Power
If silicon material is used throughout the chip, then manufacturing simplicity is maintained, but optical power input is restricted due to material limitations
Solution Approach 1:
The chip structure is segmented into two material layers with distinct functions. The first material structure layer is optimized for high-power light coupling, while the SOI silicon waveguide structure layer handles phase modulation. This segmentation enables higher optical power input while maintaining a relatively simple overall chip architecture through clear functional division.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the optical power input into the LiDAR chip, enhancing detection performance and reducing pressure on the signal detection part, while maintaining low loss and efficient light transmission.
Implementation Method 1
The first material structure layer is optically connected to the SOI silicon waveguide structure layer through the coupling connection structure
Implementation Method 2
the coupling connection structure is configured to split a light wave coupled into the chip, and couple each of split light waves into a corresponding silicon waveguide
Implementation Method 3
each of the phase modulators is configured to change a phase of a light wave coupled into a corresponding silicon waveguide in the SOI silicon waveguide structure layer
Implementation Method 4
the optical antenna is configured to transmit phase-changed light waves in silicon waveguides into space
Data Source
AI summary
The present disclosure provides a phased array LiDAR transmitting chip of mixed materials, a manufacturing method thereof, and a LiDAR device. The phased array LiDAR transmitting chip of mixed materials includes: a first material structure layer and an SOI silicon waveguide structure layer, the first material structure layer is optically connected to the SOI silicon waveguide structure layer through a coupling connection structure; the first material structure layer is configured to couple input light into the chip; the coupling connection structure is configured to split a light wave coupled to the chip, and couple each of split light waves into a corresponding silicon waveguide in the SOI silicon waveguide structure layer; where a non-linear refractive index of the first material in the first material structure layer is lower than a non-linear refractive index of silicon material.