Mixed-Material Heat-Rejecting Media for Lighter Server Cooling

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Solution Overview

Problem

Existing cooling technologies for information handling systems face challenges in balancing thermal efficiency, weight, and cost, particularly due to the use of copper, which is denser and more expensive than aluminum, despite having higher thermal conductivity.

Innovation Solution

Implementing heat-rejecting media with a combination of materials, where one portion has a higher thermal conductivity (e.g., copper) and another portion has a lower thermal conductivity (e.g., aluminum), strategically positioned within the airflow path to optimize heat dissipation and reduce weight and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If copper is used as heat-rejecting media, then thermal conductivity is improved, but weight and cost increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidweight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The patent applies local quality by using copper only in regions where high thermal conductivity is most beneficial (base portion and regions adjacent to heat-generating devices), while using lighter aluminum in other heat-rejecting portions. This localized material distribution optimizes thermal performance where needed while reducing overall weight.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining copper and aluminum in a single heat-rejecting media structure. The mixed-material construction allows the system to leverage the high thermal conductivity of copper and the low weight of aluminum, achieving a balance between thermal performance and weight reduction.

Inventive Principle:

Principle #40Composite materials

2Temperature

If copper is used as heat-rejecting media, then thermal conductivity is improved, but cost increases

Engineering Contradiction:

Improvethermal conductivityVSAvoidcost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent reduces cost by applying copper only locally where it provides the most value (base portion and regions adjacent to heat-generating devices), rather than using copper throughout the entire heat-rejecting media. This selective material application minimizes expensive material usage while maintaining essential thermal performance.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The composite construction using both copper and aluminum allows the system to achieve acceptable thermal performance at lower cost by substituting expensive copper with cheaper aluminum in portions where extreme thermal conductivity is less critical.

Inventive Principle:

Principle #40Composite materials

3Weight of moving object

If aluminum is used as heat-rejecting media, then weight and cost are reduced, but thermal conductivity decreases

Engineering Contradiction:

ImproveweightVSAvoidthermal conductivity

Core Design Contradiction:

Weight of moving objectVSTemperature

Solution Approach 1:

The patent enhances aluminum's thermal performance by strategically placing copper in high-heat-flux regions (base portion and regions adjacent to heat-generating devices), allowing aluminum to handle less critical heat transfer paths while maintaining overall thermal effectiveness.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The composite structure compensates for aluminum's lower thermal conductivity by incorporating copper in strategic locations, creating a hybrid system that achieves thermal performance closer to full-copper construction while retaining aluminum's weight advantages.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances thermal efficiency while minimizing weight and cost by leveraging the advantages of both materials, achieving better heat transfer coefficients and fin efficiency without the drawbacks of using copper alone.

Implementation Method 1

heat-rejecting media configured to thermally couple to an information handling resource may include a first portion configured to be located within an airflow and comprising a first thermally-conductive material having a first thermal conductivity and a second portion configured to be located within the airflow and comprising a second thermally-conductive material having a second thermal conductivity substantially different from the first thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat-rejecting media such as heat pipes, heat spreaders, and heat sinks are often thermally coupled to heat-generating devices of information handling systems and placed in the airflow path of an air mover, to also aid in cooling of an information handling system and its components

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20260075745A1Heat-rejecting media with mixed materials

Publication Date: 2026.03.12 DELL PROD LP

AI summary

An information handling system may include an information handling resource, an air mover configured to drive airflow within the information handling system, and heat-rejecting media thermally coupled to the information handling resource. The heat-rejecting media may include a first portion configured to be located within the airflow and comprising a first thermally-conductive material having a first thermal conductivity and a second portion configured to be located within the airflow and comprising a second thermally-conductive material having a second thermal conductivity substantially different from the first thermal conductivity.