Mixed Optical Electrical Interconnection for Display RC Delay
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Solution Overview
Problem
Large displays and high-resolution 3D or hologram displays face challenges in real-time processing due to increased resistance-capacitance (RC) delay, which limits pixel addressing and processing speed.
Innovation Solution
The implementation of mixed interconnections using optical and electrical connections, where sub displays are proportionally sized based on RC delay values, with a main signal processor connected optically to sub signal processors via optical fibers or silicon-based waveguides, allowing for efficient signal conversion and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the display size is increased to provide a large screen, then the user experience and realism are improved, but the RC delay increases making real time processing difficult
Solution Approach 1:
The display system is divided into multiple sub-displays, each with its own dedicated sub-signal processor located at or near the sub-display. This segmentation reduces the distance that electrical signals must travel, thereby reducing RC delay while maintaining large overall display size. The main signal processor handles high-level control while sub-signal processors handle local pixel addressing.
Solution Approach 2:
Optical interconnections are introduced as an intermediary medium between the main signal processor and sub-signal processors. Optical signals travel faster and without RC delay compared to electrical signals, enabling real-time processing across large display areas. The optical interconnection system includes optical converters and waveguides that mediate signal transmission between processing stages.
2Measurement precision
If the number of pixels is increased to maintain high resolution in large displays, then the overall resolution is improved, but the pixel rate increases making real time processing difficult
Solution Approach 1:
The total pixel array is segmented across multiple sub-displays, each with a manageable number of pixels addressed by dedicated sub-signal processors. This distributes the pixel processing load across multiple independent processing units rather than requiring one processor to handle all pixels, enabling real-time processing of high-resolution content.
Solution Approach 2:
The system architecture transitions from a single-plane electrical interconnection structure to a multi-dimensional hierarchy incorporating optical interconnections for high-speed data transport between processing levels. This dimensional expansion in the signal transmission architecture enables handling of high pixel rates through parallel optical channels.
3Ease of manufacture
If electrical interconnections are used for signal transmission, then the system is simple to implement, but the thickness and limitations of electrical interconnections cause RC delay
Solution Approach 1:
Optical interconnections serve as an intermediary transmission medium for signals traveling between the main signal processor and sub-signal processors over longer distances. Electrical interconnections are retained for short-distance connections where they remain effective. This hybrid approach leverages the strengths of both interconnection types while mitigating their respective weaknesses.
Solution Approach 2:
The signal transmission medium is changed from electrical to optical for specific interconnection paths. This parameter change in the transmission medium eliminates RC delay effects that plague electrical interconnections, enabling faster signal propagation across the display system while maintaining compatibility with existing electrical interfaces through optical-electrical converters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces RC delay limitations, enabling real-time high-quality information display on large screens and ultra-fine pixel 3D or hologram displays, maintaining excellent operational conditions for various applications.
Implementation Method 1
The main signal processor and the sub signal processors may be connected by using optical interconnections. The optical interconnections may be one of optical fibers and silicon-based optical waveguides.
Implementation Method 2
The main signal processor and the sub signal processors may be connected by using optical interconnections. The optical interconnections may be one of optical fibers and silicon-based optical waveguides.
Implementation Method 3
Each of the sub signal processors may include an electrical-to-optical converting element configured to convert an electrical signal received from a corresponding one of the sub displays into an optical signal.
Implementation Method 4
Each of the sub signal processors may include an optical transceiver configured to perform the conversion between the optical signal and the electrical signal.
Data Source
AI summary
A display employing a signal transmission scheme using an optical interconnection together with an electrical interconnection is provided. The display includes a screen including a plurality of sub displays configured to display information, a plurality of sub signal processors electrically connected to the plurality of sub displays, the sub signal processors being configured to perform conversion between an optical signal and an electrical signal, and a main signal processor optically connected to at least a portion of the plurality of sub signal processors.