Mixed-Orientation Multi-Die Package with Vertical Mounting

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Solution Overview

Problem

Existing multi-die packages have a large footprint and limited die integration per unit area due to the conventional horizontal or 2.5D heterogeneous die integration methods, which restricts the miniaturization and performance of integrated circuit packages.

Innovation Solution

The development of mixed-orientation multi-die (MOMD) packages that incorporate both horizontally-mounted dies (HMDs) and vertically-mounted dies (VMDs) on a shared die mount base, utilizing specialized alignment structures and interconnects to reduce footprint and enhance die integration, with copper interconnects providing ultra-low latency and eliminating the need for through-silicon vias or interposers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If conventional horizontal multi-die packages are used, then ease of manufacture is maintained, but footprint area is large and die integration per unit area is limited

Engineering Contradiction:

Improvefootprint areaVSAvoidpackage structure complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent introduces vertically-mounted dies (VMDs) in addition to horizontally-mounted dies, transitioning from a 2D horizontal arrangement to a 3D mixed-orientation arrangement. This dimensional change allows multiple dies to be stacked vertically on the same lateral footprint, significantly reducing the package area while increasing die integration density. The vertical mounting orientation enables space utilization in the Z-direction, effectively converting lateral area constraints into vertical space utilization.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If vertically-mounted dies are added to reduce footprint, then manufacturing complexity increases due to specialized alignment structures

Engineering Contradiction:

Improvefootprint areaVSAvoidmanufacturing process complexity

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent introduces a die mount base as an intermediary structure that provides specialized alignment structures (such as alignment grooves, protrusions, or registration features) to facilitate the precise positioning of vertically-mounted dies. This intermediary component mediates between the manufacturing process and the final package, enabling complex vertical die mounting while maintaining ease of manufacture through modular design and standardized alignment interfaces.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If through-silicon vias and interposers are eliminated, then manufacturing cost is reduced, but interconnect reliability must be maintained

Engineering Contradiction:

Improvemanufacturing costVSAvoidinterconnect reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts and eliminates the through-silicon via (TSV) and interposer components from the traditional 3D packaging architecture. By removing these intermediate structures, the design achieves cost reduction and manufacturing simplification. The direct mounting of dies to the substrate with simplified interconnect structures replaces the complex TSV/interposer pathway, maintaining reliability through alternative interconnection methods such as wire bonds, bump bonds, or direct solder connections.

Inventive Principle:

Principle #2Taking out (Extraction)

4Quantity of substance

If mixed-orientation mounting is implemented, then die integration per unit area increases, but alignment precision requirements increase

Engineering Contradiction:

Improvedie integration per unit areaVSAvoidalignment precision

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent implements preliminary alignment actions through pre-formed alignment structures on the die mount base and corresponding alignment features on both horizontally-mounted and vertically-mounted dies. These alignment structures (such as grooves, protrusions, or registration marks) are created during the manufacturing process before final assembly, enabling precise positioning of dies in both horizontal and vertical orientations. This preliminary preparation of alignment features ensures high alignment precision during the packaging process, facilitating increased die integration density.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11043471B2Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die

Publication Date: 2021.06.22 MICROCHIP TECHNOLOGY INC

AI summary

A mixed-orientation multi-die (“MOMD”) integrated circuit package includes dies mounted in different physical orientations. An MOMD package includes both (a) one or more dies horizontally-mounted dies (HMDs) mounted horizontally to a horizontally-extending die mount base and (b) one or more vertically-mounted dies (VMDs) mounted vertically to the horizontally-extending die mount base. HMDs may include FPGAs or other high performance chips, while VMDs may include low performance chips and other physical structures such as heat dissipators, memory, high voltage/analog devices, sensors, or MEMS, for example. The die mount base of an MOMD package may include structures for aligning and mounting VMD(s), for example, VMD slots for receiving each mounted VMD, and VMD alignment structures that facilitate aligning and/or guiding a vertical mounting of each VMD to the die mount base. MOMD packages may provide a reduced lateral footprint and increased die integration per unit area, as compared with conventional multi-die packages.