Mixed Signal Test Interface Integration for High-Speed Chip Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor testing apparatuses experience signal attenuation and noise due to long metal wires between the test interface and mixed signal generation circuits, especially when testing high-speed chips, leading to incorrect test results.
Innovation Solution
Integrating mixed signal generation circuits into the test interface of the device under test (DUT) to reduce signal distance, allowing for direct signal transmission and enabling easy replacement with digital-analog or analog-digital converting circuits, thus reducing noise and test costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mixed signal generation circuits are disposed separately from the test interface, then the tester can test various chips using the mixed-signal module, but the long metal wires cause signal attenuation and noise increased
Solution Approach 1:
The patent integrates the mixed signal generation circuits directly into the test interface card, merging previously separate components (tester module and test interface) into a unified structure. This eliminates long metal wires connecting separate modules, thereby reducing signal attenuation and noise while maintaining the ability to test various chip types through the integrated circuits.
2Reliability
If mixed signal generation circuits are integrated into the test interface, then signal distance is decreased and noise is reduced, but the device complexity increases
Solution Approach 1:
The patent segments the test system into distinct functional modules: the integrated mixed signal generation circuits on the test interface card, the probe card, and the main tester. This segmentation allows the complex functionality to be distributed across manageable components, making the system easier to design, manufacture, and maintain while achieving reduced signal distance and improved signal quality.
3Stability of the object's composition
If the tester uses fixed mixed-signal module configuration, then the testing apparatus can operate stably, but upgrading or replacing test capabilities requires replacing the entire tester
Solution Approach 1:
The patent creates a dynamic, reconfigurable test interface where the mixed signal generation circuits can be easily replaced or upgraded by simply changing the test interface card or probe card assemblies. This dynamic design allows the system to maintain operational stability during normal use while enabling cost-effective upgrades and replacements without requiring entire tester replacement, adapting to different testing requirements through modular interchangeability.
Data Source
AI summary
An under testing device interface with mixed-signal processing circuit is disclosed. The under testing device interface with mixed signal processing circuit software of integrates the mixed-signal processing circuit into the probe card or device under testing card, the mixed-signal processing circuit with the pin electric channel of the tester, and the programs for handling the process of mixed-signal processing circuit into the system software of the tester.