Mixed-Size Connector IC Structure for 2.5D Integration
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Solution Overview
Problem
Current integrated circuit (IC) technologies face challenges in achieving efficient and cost-effective bonding of dies with different connector sizes in 2.5D and 3D structures, leading to variations in bonding accuracy and throughput.
Innovation Solution
The use of interposers with through-substrate vias (TSVs) and varying connector sizes, such as minibumps and microbumps, allows for differential bonding precision and cost-effective integration of dies with different densities of inputs and outputs, enabling efficient attachment of dies with larger and smaller connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dies with different connector sizes are bonded using conventional techniques, then integration density and functionality are improved, but bonding accuracy and throughput vary leading to increased costs
Solution Approach 1:
The patent applies local quality by configuring different connector sizes (e.g., larger C4 bumps for memory dies, smaller microbumps for logic dies) at different locations on the interposer substrate. This allows each die type to be bonded with optimized precision levels matched to its specific requirements, rather than forcing uniform bonding parameters across all dies.
Solution Approach 2:
The interposer substrate is segmented into different bonding regions with different connector specifications. This segmentation enables independent optimization of bonding processes for different die types, allowing high-precision bonding for logic dies and standard-precision bonding for memory dies, thereby improving overall manufacturing efficiency and reducing costs.
2Adaptability or versatility
If dies with different connector sizes are bonded using conventional techniques, then functionality is improved, but throughput varies leading to increased costs
Solution Approach 1:
Different bonding regions on the interposer are configured with local quality characteristics matching the specific die requirements. High-functionality logic dies use smaller connectors requiring higher precision but can be processed in dedicated regions, while memory dies use larger connectors with standard processing, optimizing overall throughput without compromising functionality.
Solution Approach 2:
The bonding process is segmented into different operational zones on the interposer substrate. This allows parallel processing of different die types with appropriate throughput optimization for each, preventing the entire assembly line from being constrained by the most time-consuming bonding operation.
3Ease of manufacture
If uniform connector sizes are used for all dies, then bonding process simplicity is improved, but integration density and functionality are limited
Solution Approach 1:
The interposer substrate serves as an intermediary that absorbs the complexity of handling different connector sizes. It provides standardized mounting interfaces for various die types while presenting a unified structure for packaging, thereby maintaining ease of manufacture at the system level despite the diversity of connector configurations.
Solution Approach 2:
The interposer substrate performs multiple functions: it provides mechanical support, enables different connector configurations for different dies, facilitates heat dissipation, and simplifies the overall packaging process. This multi-functionality allows the system to achieve high integration density without sacrificing manufacturing simplicity.
Data Source
AI summary
An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface. The first die is attached to the first surface of the substrate by first electrical connectors. The second die is attached to the first surface of the substrate by second electrical connectors. A size of one of the second electrical connectors is smaller than a size of one of the first electrical connectors.