Mixed Substrate Thermal Block Layout for Embedded Package Cooling
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Solution Overview
Problem
Existing embedded packaging substrates fail to meet the increasing heat dissipation requirements of miniaturized electronic components due to higher integration levels and heat generation, necessitating a new method for manufacturing high-heat-dissipation mixed substrates.
Innovation Solution
A method involving a mother substrate with insulating layers and temporary carrier plates, where thermally-conductive grooves and cavities are filled with conductive materials to form blocks, and circuit layers are manufactured on both sides, allowing for efficient heat dissipation by creating a thermally-conductive surface upon cutting along region dividing lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional embedded packaging substrates are used, then the substrate structure is simple and easy to manufacture, but the heat dissipation capacity is insufficient to meet the requirements of miniaturized and high-integration electronic products
Solution Approach 1:
The substrate is divided into multiple sub-substrates arranged in an array, with each sub-substrate containing embedded devices and thermally-conductive blocks. This segmentation allows heat dissipation to be distributed across multiple independent units, improving overall heat dissipation capacity while maintaining manufacturing simplicity through standardized replication of sub-substrate modules
Solution Approach 2:
Thermally-conductive blocks are added in the vertical dimension, extending from the front surface through the insulating layer to the rear surface of the substrate. This three-dimensional heat dissipation structure provides additional heat conduction pathways, significantly improving heat dissipation capacity without increasing the planar footprint of the substrate
2Volume of moving object
If the integration level of the substrate is increased to achieve miniaturization, then the product size is reduced, but the heat generation increases and requires higher heat dissipation requirements
Solution Approach 1:
High-heat-dissipation regions are created locally around embedded devices by positioning thermally-conductive blocks adjacent to heat-generating components. Each sub-substrate contains thermally-conductive blocks strategically positioned to conduct heat away from specific embedded devices, providing localized heat dissipation where it is most needed while maintaining compact overall substrate size
Solution Approach 2:
The substrate employs composite construction combining insulating layer material with embedded devices and thermally-conductive blocks made of materials with high thermal conductivity. This composite structure integrates electrical insulation with targeted thermal conduction pathways, enabling compact high-density integration while managing heat generation through material property optimization
3Temperature
If thermally-conductive blocks are added to improve heat dissipation, then the heat dissipation performance is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The thermally-conductive blocks are pre-positioned and integrated into the insulating layer during the substrate fabrication process, before the embedded devices are mounted. This preliminary integration of heat dissipation structures simplifies subsequent assembly steps and allows heat dissipation functionality to be built-in during standard manufacturing processes, reducing overall manufacturing complexity
Solution Approach 2:
The substrate structure merges multiple functions into a single integrated component: the insulating layer provides both electrical insulation and structural support, while thermally-conductive blocks simultaneously conduct heat and occupy space that would otherwise be empty. This merging of insulation, heat dissipation, and structural functions into unified elements reduces the number of separate components and simplifies the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation efficiency by allowing thermally-conductive surfaces to quickly dissipate heat from circuit layers and embedded devices to the external environment, addressing the limitations of traditional substrates.
Implementation Method 1
the first thermally-conductive block and the second thermally-conductive block both extend through the insulating layer in the direction perpendicular to the mother substrate; allowing thermally-conductive surfaces to quickly dissipate heat from circuit layers and embedded devices to the external environment
Data Source
AI summary
A method for manufacturing a high-heat-dissipation mixed substrate includes: preparing a mother substrate, the mother substrate including an insulating layer and a temporary carrier plate which are laminated; arranging a plurality of first grooves and a plurality of first cavities on the mother substrate; filling the first groove with a thermally-conductive material to form a first thermally-conductive block, and adhering an embedded device in the first cavity and filling the first cavity with the thermally-conductive material to form a second thermally-conductive block; removing the temporary carrier plate to obtain a semi-finished substrate; manufacturing circuit layers on two opposite side surfaces of the semi-finished substrate to obtain a target mother substrate; and cutting the target mother substrate along region dividing lines to obtain a mixed substrate with a side surface being a thermally-conductive surface.