Mixed-Type Memory Slots on Main Board for Cooling and Routing
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Solution Overview
Problem
The existing design of half-width server main boards experiences overheating and electromagnetic radiation due to blocked airflow and close proximity of memory modules, which affects CPU and memory module cooling efficiency and requires reducing the distance between memory slots to accommodate signal wires, leading to further overheating and electromagnetic interference.
Innovation Solution
The implementation of mixed-type memory slots, comprising surface-mounted and through-hole slots, allows for parallel channels with surface-mounted slots between through-hole slots, enabling better airflow and routing of signal wires without reducing the distance between memory modules, thus addressing overheating and electromagnetic interference issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the distance between memory modules is reduced to accommodate signal wires, then signal wire routing is improved, but cooling efficiency deteriorates and overheating occurs
Solution Approach 1:
The patent introduces a third dimension (through-hole slots penetrating the main board) to resolve the two-dimensional conflict between signal wire routing and cooling. Through-hole slots allow signal wires to pass through the main board vertically, eliminating the need to reduce horizontal distance between memory modules, thus maintaining both routing feasibility and cooling efficiency
Solution Approach 2:
The patent segments memory slots into two distinct types: surface-mounted slots for memory modules and through-hole slots for signal wire routing. This segmentation allows independent optimization of each function - memory modules remain at optimal spacing for cooling while signal wires use dedicated through-hole pathways, eliminating the trade-off between routing and thermal management
2Area of stationary object
If memory modules are placed close together, then space utilization is improved, but airflow is blocked and cooling efficiency deteriorates
Solution Approach 1:
The through-hole slots provide a vertical dimension for airflow pathways, allowing cool air to pass through the main board and reach memory modules from below, complementing the horizontal airflow. This multi-directional airflow approach enables compact memory module placement while maintaining effective cooling
Solution Approach 2:
The patent applies different slot configurations at different locations: surface-mounted slots are positioned to optimize memory module access and spacing, while through-hole slots are strategically placed to create localized airflow channels. This local differentiation ensures both compact layout and effective cooling in critical areas
3Reliability
If through holes are added to memory slots for signal wire routing, then signal transmission is improved, but electromagnetic radiation increases
Solution Approach 1:
The through-hole slots act as intermediaries that provide dedicated, shielded pathways for signal wires to pass through the main board. By confining signal wires within the structured through-hole geometry rather than allowing them to route through the memory slot openings, the patent reduces electromagnetic radiation while maintaining signal transmission integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency by allowing airflow and reduces electromagnetic interference by providing a space for signal wire routing, maintaining the required distance between memory modules and supporting CPU and memory module performance.
Implementation Method 1
air flow A provided by cooling fans flows from the front side 1a of the main board 1A to the rear side 1b of the main board 1A
Data Source
AI summary
A main board, comprising a first set of memory slots, the first set of memory slots comprising a first channel and a second channel disposed in parallel with each other, and each of the first channel and the second channel comprising a first type of slot and a second type of slot respectively, wherein the first type of slot and the second type of slot of the first channel are disposed at a first side and a second side of the first channel respectively, the first type of slot and the second type of slot of the second channel are disposed at a first side and a second side of the second channel respectively, and the first side of the first channel is adjacent to the first side of the second channel.