Printed Wiring Board Layout for Mixed-Voltage Insulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current printed wiring boards require separate designs and increased development costs due to the need for different insulation distances and connector types for low voltage and high voltage circuits, leading to increased size and assembly complexity in devices like ceiling duct air conditioners.
Innovation Solution
A printed wiring board design that incorporates a primary circuit for high voltage, a low voltage circuit, and a common circuit with insulators to accommodate both low and high voltage components, allowing for shared use on a single board with appropriate jumper configurations for insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate printed wiring boards are provided for low voltage and high voltage circuits, then insulation distance requirements are met, but development costs and device complexity increase
Solution Approach 1:
The patent combines both low voltage and high voltage circuits onto a single printed wiring board by providing a high voltage circuit pattern and a low voltage circuit pattern on the same substrate. This merging approach reduces the number of separate boards needed while maintaining proper insulation through carefully designed spacing and insulation structures between the high voltage and low voltage circuit regions.
2Reliability
If different connectors are used for low voltage and high voltage circuits, then electrical safety is ensured, but manufacturing costs and assembly complexity increase
Solution Approach 1:
The patent designs the printed wiring board with universal mounting structures that can accommodate both low voltage connectors and high voltage connectors on the same board. The board includes both a connector for low voltage circuits and a terminal block for high voltage circuits, with both types of components being mountable on the same substrate through standardized mounting holes and patterns, thereby reducing the need for completely separate connector designs.
3Device complexity
If a single printed wiring board is used for both low and high voltage circuits, then development costs are reduced, but insulation distance requirements become more difficult to meet
Solution Approach 1:
The patent applies different design characteristics to different regions of the printed wiring board. The high voltage circuit pattern and low voltage circuit pattern are positioned with appropriate spacing, and insulation structures are strategically placed between these regions. This local differentiation ensures that insulation distance requirements are met in the critical areas between high and low voltage circuits while allowing other areas of the board to be optimized for their specific functions.
4Reliability
If connector and terminal block are provided off the printed wiring board, then insulation requirements are met, but device size and assembly complexity increase
Solution Approach 1:
The patent integrates both the connector for low voltage circuits and the terminal block for high voltage circuits directly onto the printed wiring board. This integration eliminates the need for separate mounting structures and reduces the overall device volume by consolidating multiple components onto a single substrate, while maintaining proper insulation through designed spacing and insulation structures on the board.
Data Source
AI summary
A printed wiring board includes a primary circuit that receives power supply of a high voltage from a high power source; a pattern for a low voltage circuit that is used when a low voltage component used for a low voltage lower than the high voltage and a power supply terminal block that receives power supply of the low voltage from a low power source are provided; a pattern for a common circuit that is used when a high voltage component used for the high voltage and the low voltage that insulates the pattern for the primary circuit from the pattern for the common circuit; a first insulator which insulates the pattern of the primary circuit from the pattern of the common circuit; and a second insulator that insulates the pattern for the common circuit from the pattern for the low voltage circuit.