Modular Mixed-Voltage Processor Architecture for Integrated Analog Control
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Solution Overview
Problem
Current microcontroller unit (MCU) architectures either lack integrated analog peripherals, requiring extensive external circuitry, or are specialized and inflexible, limiting their applicability and platformization in high-voltage applications.
Innovation Solution
A micro-application processor (MAP) architecture integrating low-voltage digital and analog modules with selectively connected high-voltage analog modules, enabling power input, mixed-signal processing, and load driving, while allowing for customization and platformization by adding or removing functional modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional general-purpose digital control chip is used, then digital control functions are implemented, but analog peripheral functions are insufficient and require extensive external circuitry
Solution Approach 1:
The patent merges digital control functions and analog peripheral functions into a single integrated chip. The chip includes both digital processing units and analog signal processing units (such as ADC, DAC, operational amplifiers) on the same substrate, eliminating the need for extensive external analog circuitry while maintaining full functionality.
Solution Approach 2:
The control chip is designed with multi-functional capabilities, incorporating both digital control operations and various analog signal processing functions within a single device. This universal design allows the chip to handle mixed-signal applications without requiring separate dedicated chips for analog and digital functions.
2Reliability
If dedicated chip for single application is used, then high specialization is achieved, but flexibility and platformization are limited
Solution Approach 1:
The chip architecture is segmented into modular functional blocks including digital processing modules, analog signal processing modules, and interface modules. Each module can be independently configured or selected based on specific application requirements, allowing the same chip platform to be adapted for different applications by enabling or disabling specific modules.
Solution Approach 2:
The chip incorporates dynamic configuration capabilities where functional modules can be selectively activated or deactivated based on the specific application. This dynamic adaptability allows a single chip design to serve multiple applications, achieving both specialization for reliable performance and flexibility for platformization.
3Adaptability or versatility
If extensive peripheral hardware is constructed around the chip, then analog functions are achieved, but component count and system complexity increase
Solution Approach 1:
The patent integrates analog signal processing functions directly into the chip substrate, combining what would traditionally require separate external components (such as operational amplifiers, ADCs, DACs) into built-in functional blocks. This integration dramatically reduces the component count while maintaining full analog signal processing capability.
4Reliability
If specialized dedicated chips are used, then specific low-voltage applications are optimized, but high-voltage applications and platformization are not suitable
Solution Approach 1:
The control chip is designed with universal applicability across both low-voltage and high-voltage domains. The chip incorporates voltage-scaling circuits and configurable voltage reference modules that can be adapted to different voltage levels, allowing the same chip platform to reliably operate in both low-voltage consumer electronics and high-voltage industrial applications.
Data Source
AI summary
A MAP architecture includes a low-voltage digital module, a low-voltage analog module, and one or more high-voltage analog modules. The low-voltage digital module is communicatively connected to the digital signal bus for implementing digital functions, the low-voltage analog module is communicatively connected to the low-voltage digital module and the digital signal bus for implementing low-voltage analog functions, and the high-voltage analog modules are communicatively connected to one or more of the low-voltage digital module, the digital signal bus, and the low-voltage analog module for implementing high-voltage analog functions. The present disclosed MAP architecture integrates low-voltage and high-voltage analog functions required for applications such as energy-saving power control. These functions include power input, mixed-signal processing, and load driving. The integration of these functions allows users to reduce the construction of peripheral hardware analog circuits as much as possible. It caters to universal requirements for digital control and associated analog circuits.