High Voltage MLCC Arc Shield Pattern Layers
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Solution Overview
Problem
Conventional high voltage multilayer ceramic capacitors are unable to effectively shield surface arc-over generation phenomena occurring perpendicular to the vertical direction, which can lead to dielectric breakdown and reduced reliability.
Innovation Solution
The capacitors are designed with internal electrodes exposed on the top or bottom surface of the multilayer ceramic sintering body, and arc shield pattern layers are formed to surround the electrodes, preventing surface arc-over by managing the electric field.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional high voltage multilayer ceramic capacitors are used with traditional shield layer configuration, then surface arc-over generation in the vertical direction can be shielded, but surface arc-over generation perpendicular to the vertical direction cannot be effectively shielded
Solution Approach 1:
The patent extends the shielding function from the vertical direction to the horizontal direction by forming arc shield pattern layers on the front and rear surfaces of the multilayer ceramic body. These pattern layers create a two-dimensional shielding network that blocks surface arc-over generation in both vertical and horizontal directions, resolving the limitation of conventional single-direction shielding
Solution Approach 2:
The shield layer is divided into multiple arc shield pattern layers positioned at different locations on the front and rear surfaces. Each pattern layer is segmented into specific regions that correspond to different internal electrodes, creating a distributed shielding system that effectively manages electric fields across the entire capacitor surface
2Reliability
If internal electrodes are exposed on the top or bottom surface to improve mounting and adhesive force, then reliability and adhesive force with PCB improve, but manufacturing complexity increases
Solution Approach 1:
The patent combines the arc shield pattern formation with the internal electrode formation process. Both the internal electrodes and arc shield patterns are formed simultaneously on the green sheets before lamination and sintering, eliminating the need for separate post-processing steps and reducing manufacturing complexity despite the exposed electrode configuration
Solution Approach 2:
The arc shield patterns are formed in advance on the green sheets during the electrode formation stage, before the multilayer structure is assembled and sintered. This preliminary formation of shield patterns simplifies the overall manufacturing process by integrating multiple functions into the initial fabrication steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields surface arc-over generation phenomena, improving the reliability and adhesive force with printed circuit boards, and simplifies the manufacturing process by integrating shield layers during electrode formation.
Implementation Method 1
arc shield pattern layers which are spaced apart from the internal electrodes to be surrounded by the internal electrodes in plan view, and one end of each of the arc shield pattern layers is exposed to the front or rear surface of the multilayer ceramic sintering body
Data Source
AI summary
Provided is a high voltage multilayer ceramic capacitor and a manufacturing method thereof. The high voltage multilayer ceramic capacitor includes a multilayer ceramic sintering body; a plurality of first inner electrode layer; a plurality of second inner electrode layers; a plurality of first arc shield pattern layers respectively formed inside the multilayer ceramic sintering body to be arranged on a plane the same as those of the plurality of first inner electrode layers and spaced apart from the first inner electrode layers to surround the first inner electrode layers; and a plurality of second arc shield pattern layers respectively formed inside the multilayer ceramic sintering body to be arranged on a plane the same as those of the plurality of second inner electrode layers and spaced apart from the second inner electrode layers to surround the second inner electrode layers.