MLCC Array Substrate Integration for Compact Thermal-Efficient Modules
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Solution Overview
Problem
Conventional charge pump modules require significant area for passive and active components, leading to thermal management challenges and increased manufacturing costs, with heat dissipation primarily through metal contacts and PCBs having poor thermal conductivity.
Innovation Solution
The integration of multilayer ceramic capacitors (MLCCs) in a resin-based substrate with a redistribution layer (RDL) and an integrated circuit (IC), allowing for reduced module area, improved heat management, and cost-effective manufacturing through methods like thermocompression or hybrid bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional charge pump modules use separate PCB mounting for passive and active components, then the module area increases, but thermal management becomes more difficult and manufacturing costs increase
Solution Approach 1:
The patent merges passive components (MLCCs) and active components (IC) onto a single resin-based substrate, eliminating the need for separate PCB mounting. This integration reduces the overall module area while improving thermal management by allowing direct heat access to the chip through the substrate, eliminating thermal resistance associated with separate mounting structures.
Solution Approach 2:
The patent uses a resin-based substrate as a composite material that serves multiple functions: electrical insulation, mechanical support, and thermal management. The resin material allows direct heat access to the IC chip while providing structural integrity and electrical isolation, resolving the contradiction between compact area and effective thermal management.
2Ease of manufacture
If conventional modules use standard PCB mounting, then manufacturing is simpler, but manufacturing costs increase and module thickness increases
Solution Approach 1:
The patent combines multiple manufacturing steps into a single substrate fabrication process. The resin-based substrate is formed with embedded MLCCs and RDL patterns in one integrated process, eliminating separate PCB mounting operations. This reduces manufacturing complexity while lowering costs through process integration and material efficiency.
Solution Approach 2:
The patent changes the substrate material parameter from traditional PCB to resin-based composite, enabling new manufacturing approaches. The resin material can be molded and cured in a single process step, embedding passive components and forming conductive paths simultaneously, which simplifies manufacturing and reduces costs compared to multi-step PCB assembly.
3Ease of operation
If the module uses thicker substrate and separate component mounting, then assembly is easier, but thermal resistance increases and power density decreases
Solution Approach 1:
The patent merges components into a thin, integrated resin-based substrate structure where MLCCs are embedded and ICs are mounted in close proximity. This integration maintains assembly simplicity through standardized bonding processes while dramatically reducing the distance for heat dissipation paths, thereby increasing power density without sacrificing ease of assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased power density, reduced manufacturing costs, and effective thermal management by facilitating direct heat access to the chip, reducing thermal resistance and enabling thinner modules with enhanced electrical performance.
Implementation Method 1
facilitating direct heat access to the chip, reducing thermal resistance
Implementation Method 2
performing face-to-face thermocompression bonding between the resin-based substrate and the IC
Implementation Method 3
performing face-to-face hybrid bonding between the resin-based substrate and the IC
Data Source
AI summary
Packages and methods for fabricating a module with reduced area, including forming a resin-based substrate by forming a resin on a plurality of multilayer ceramic capacitors (MLCCs). Packages and methods for fabricating a module with reduced area include forming a MLCC-based substrate by forming a resin on a plurality of MLCCs, wherein each MLCC of the plurality of MLCCs directly contacts another MLCC.