MLCC Third Electrode Asymmetry for Heat Dissipation
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Solution Overview
Problem
Multi-layer ceramic capacitors face challenges in miniaturization and increased capacitance, with side surface external electrodes prone to radiant heat and difficult to exhaust, leading to reduced connection reliability during mounting.
Innovation Solution
A multi-layer ceramic capacitor design with a third external electrode having shifted side-surface regions, optimized soldering configurations, and specific dimensional relationships to enhance connection reliability by moderating rotational moments and void removal during soldering, allowing for improved heat dissipation and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the multi-layer ceramic capacitor is miniaturized and capacitance is increased, then the size is reduced and capacitance is improved, but the calorific value increases and heat dissipation becomes difficult
Solution Approach 1:
The third external electrode is designed with asymmetric shifted side-surface regions instead of symmetric configuration. The first side-surface region and second side-surface region are shifted relative to each other in the length direction, creating an asymmetric structure that generates rotational moment during soldering to facilitate void removal and improve heat dissipation.
Solution Approach 2:
The shifted side-surface regions are pre-configured in the electrode design before mounting. This preliminary asymmetric configuration ensures that when solder is applied, the surface tension automatically generates the necessary rotational moment to remove voids and improve connection reliability, without requiring additional manual intervention.
2Reliability
If the third external electrode is formed on the side surface, then connection is improved, but the electrode receives radiant heat and difficult to exhaust heat
Solution Approach 1:
The asymmetric shifted configuration of side-surface regions creates an imbalance in heat distribution and solder wetting. This asymmetry generates rotational moment that promotes void removal and improves heat exhaust pathways, allowing the side-surface electrode to maintain connection reliability while improving heat dissipation.
3Reliability
If the side-surface regions are shifted, then rotational moment is generated for void removal, but excessive rotation may occur
Solution Approach 1:
The shift amount between side-surface regions is precisely controlled within specific parameter ranges (0.03≤G/D3≤0.50). This parameter optimization ensures that the rotational moment generated during soldering is sufficient to remove voids but not excessive to cause misalignment, maintaining both connection reliability and mounting position precision.
Solution Approach 2:
The design incorporates feedback control through the relationship between shift amount G and electrode dimension D3. By maintaining the ratio G/D3 within 0.03-0.50, the system self-regulates the rotational moment to achieve optimal void removal while preventing excessive rotation that would compromise mounting precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances connection reliability by facilitating void removal and self-alignment, ensuring reliable mounting and efficient heat dissipation, while allowing for increased capacitance and miniaturization.
Implementation Method 1
due to the surface tension of the solder, the multi-layer ceramic capacitor is easy to rotate with a lamination direction being as the axis
Data Source
AI summary
A multi-layer ceramic capacitor includes: a ceramic body including first and second end surfaces, first and second side surfaces, first internal electrodes drawn to the first and second end surfaces, second internal electrodes drawn to at least one of the first side surface and the second side surface, and dielectric layers, the first and second internal electrodes being alternately laminated via the dielectric layers; first and second external electrodes that respectively cover the first and second end surfaces, and extend to each of the first and second side surfaces; a third external electrode including a first side-surface region formed on the first side surface and a second side-surface region formed on the second side surface, the first side-surface region and the second side-surface region being formed to be mutually shifted along the first direction and at least partially facing each other in the second direction.