Multilayer Ceramic Capacitor Asymmetric Insulating Layers
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Solution Overview
Problem
Multilayer ceramic capacitors with a thickness greater than their width tend to topple over when mounted on a circuit board, leading to increased failure rates and the occurrence of Tombstone defects due to surface tension of solder, which affects their reliability and capacitance.
Innovation Solution
A multilayer ceramic capacitor design with a hexahedral ceramic body having a thickness greater than its width, featuring internal electrodes and insulating layers with specific thickness ratios to prevent toppling and ensure reliable mounting, including dielectric layers with an average thickness of 0.1 μm to 0.8 μm and internal electrodes with an average thickness of 0.6 μm or less, and insulating layers with thicknesses that satisfy 0.05≦Ta/T≦0.97, where Ta is the insulating layer thickness and T is the ceramic body thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of dielectric layers is reduced and the number of stacked layers is increased to achieve high capacitance and miniaturization, then the capacitance and size are improved, but the thickness becomes greater than the width causing the component to topple over during mounting
Solution Approach 1:
The patent applies asymmetry by forming insulating layers only on the lateral surfaces of the ceramic body, creating an asymmetric structure where the mounting surfaces (top and bottom) have different properties from the lateral surfaces. This asymmetric design with insulating layers on lateral surfaces only provides mechanical support during mounting without affecting the electrical performance, thereby preventing toppling while maintaining high capacitance.
2Quantity of substance
If the thickness of the multilayer ceramic electronic component is made greater than its width to increase capacitance, then the capacitance is improved, but Tombstone defect occurs due to surface tension of solder during mounting
Solution Approach 1:
The insulating layers formed on the lateral surfaces act as an intermediary element that mediates between the solder and the ceramic body during mounting. These insulating layers provide a surface that interacts with the solder in a controlled manner, preventing the surface tension from causing the Tombstone defect while still allowing proper solder joint formation, thus maintaining both high capacitance and mounting precision.
3Reliability
If insulating layers are formed on lateral surfaces with appropriate thickness ratios, then mounting reliability is improved by preventing toppling, but the device complexity increases
Solution Approach 1:
The patent applies local quality by forming insulating layers only on specific locations (lateral surfaces) of the ceramic body rather than uniformly across all surfaces. This localized approach provides the necessary mechanical support and mounting reliability where needed, while avoiding unnecessary complexity in areas where insulating layers are not required, thus optimizing the balance between mounting reliability and structural simplicity.
Data Source
AI summary
There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes: a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; first and second internal electrodes stacked to face one another, with the dielectric layer interposed therebetween, within the ceramic body; and insulating layers formed on both lateral surfaces of the ceramic body and having a thickness less than that of the ceramic body, wherein when the sum of the width of the ceramic body and widths of the insulating layers is defined as Wb, 0.90≦W/Wb≦0.97 is satisfied.