MLCC Internal Electrode Au Interface for Insulation Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in downsizing ceramic electronic devices, such as multilayer ceramic capacitors, is to maintain insulation reliability while reducing the thickness of dielectric layers, which increases electric field intensity and can lead to internal electrode layer breakage and capacity reduction, especially when excessive Au is used.
Innovation Solution
A ceramic electronic device with internal electrode layers containing an Au-containing layer on interfaces with dielectric layers, where the Au concentration is 5% or more, and the thickness of the Au-containing layer is optimized to satisfy the relationship C≤500×t/T, reducing Au usage and maintaining the melting point of the Au-Ni alloy, thereby suppressing internal electrode layer breakage and improving insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of dielectric layers is reduced to downsize the device, then the device size is reduced, but the electric field intensity increases causing internal electrode layer breakage and capacity reduction
Solution Approach 1:
The patent applies local quality by creating an Au-containing layer specifically at the interface between the internal electrode layer and dielectric layer, rather than uniformly distributing Au throughout the internal electrode layer. This localized concentration of Au at the critical interface region provides enhanced insulation and prevents breakage where the electric field intensity is highest, while maintaining overall device downsizing.
Solution Approach 2:
The patent changes the concentration parameter of Au from a uniform distribution to a localized interface concentration of 5 at % or more. This parameter change transforms the internal electrode layer structure to have higher Au concentration at the critical interface region, which modifies the local electrical properties to prevent breakage while allowing thinner dielectric layers.
2Reliability
If excessive Au is used in internal electrode layers, then insulation reliability is improved, but the melting point of the Au-Ni alloy decreases causing internal electrode layer breakage
Solution Approach 1:
The patent applies local quality by concentrating Au specifically at the interface region between the internal electrode layer and dielectric layer, rather than uniformly distributing it throughout the entire internal electrode layer. This localized approach provides the necessary insulation reliability at the critical interface while maintaining the overall structural integrity and melting point of the Au-Ni alloy in the bulk material.
Solution Approach 2:
The patent applies partial action by using Au only where necessary (at the interface region) rather than throughout the entire internal electrode layer. The Au concentration is carefully controlled to be 5 at % or more specifically at the interface, which is sufficient to prevent breakage and improve insulation reliability without excessively lowering the melting point of the overall alloy structure.
3Reliability
If Au concentration is increased to prevent internal electrode layer breakage, then insulation reliability is improved, but the cost of the device increases
Solution Approach 1:
The patent applies local quality by concentrating Au specifically at the interface region between the internal electrode layer and dielectric layer, rather than uniformly distributing it throughout the entire internal electrode layer. This localized concentration approach achieves the necessary insulation reliability at the critical interface while minimizing the overall amount of Au used in the device.
Solution Approach 2:
The patent extracts Au from the bulk internal electrode layer material and concentrates it specifically at the interface region. This extraction and relocation of Au to where it is most needed (the interface) provides maximum insulation effectiveness with minimum material usage, reducing both cost and environmental impact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of internal electrode layer breakage, lowers product costs, and enhances insulation reliability by using a controlled amount of Au, allowing for the use of recycled materials and minimizing environmental impact.
Implementation Method 1
each of the plurality of internal electrode layers includes an Au-containing layer of which an Au concentration with respect to all detected elements is 5 at % or more, on an interface between the each of the plurality of internal electrode layers and a dielectric layer
Data Source
AI summary
A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Au. Each of the plurality of internal electrode layers includes an Au-containing layer of which an Au concentration with respect to all detected elements is 5 at % or more, on an interface between the each of the plurality of internal electrode layers and a dielectric layer next to the each of the plurality of internal electrode layers. A relationship of C≤500×t/T is satisfied when a thickness of the each of the plurality of internal electrode layers is T nm, a thickness of the Au-containing layer is t nm, and an Au concentration with respect to a total of Ni and Au in a whole of the each of the plurality of internal electrode layers is C at %.