Multilayer Ceramic Capacitor Electrode Connectivity via Bimodal Paste
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in maintaining electrode connectivity and withstand voltage characteristics due to the decrease in size of internal electrodes, leading to sintering shrinkage issues and reduced filling rates of inorganic materials, which deteriorate performance.
Innovation Solution
Incorporating a ceramic additive in the internal electrodes, positioned apart from the dielectric layer boundary, using conductive pastes with different metal particle sizes to form layers that enhance electrode connectivity and withstand voltage, with a specific ratio of large-sized particles in the central portion and small-sized particles in the outer region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of internal electrode material is decreased to achieve miniaturization, then compact size and high capacitance are improved, but sintering shrinkage suppressing capability deteriorates and electrode connectivity after sintering is deteriorated
Solution Approach 1:
The patent applies local quality by using two different conductive pastes with different metal particle sizes in different regions of the internal electrode pattern. The first conductive paste with larger metal particles (5-10 μm) is used in the central portion where electrode connectivity is critical, while the second conductive paste with smaller metal particles (1-3 μm) is used in the outer region adjacent to the ceramic green sheet. This spatial differentiation of material properties resolves the contradiction by optimizing each region for its specific functional requirement.
Solution Approach 2:
The patent employs composite materials by combining conductive pastes with different metal particle size distributions to form a multi-layered electrode structure. The composite approach integrates the sintering shrinkage resistance of larger particles in the central region with the fine dispersion capability of smaller particles in the outer region, achieving both miniaturization and maintained electrode connectivity through material composition optimization.
2Quantity of substance
If excessive amount of organic material is used for dispersing fine material, then filling rate of inorganic material is decreased, but dispersibility is improved; however, this causes deterioration of electrode connectivity after sintering and increase of residual carbon
Solution Approach 1:
The patent applies parameter changes by optimizing the metal particle size distribution parameter in the conductive paste formulation. By using a bimodal distribution with specific size ranges (5-10 μm and 1-3 μm) rather than excessive fine particles, the patent achieves adequate dispersibility without requiring excessive organic material, thereby maintaining high inorganic material filling rate and ensuring good electrode connectivity after sintering.
3Volume of moving object
If dielectric layer is thinned to achieve high capacitance, then capacitance density is improved, but withstand voltage characteristics deteriorate
Solution Approach 1:
The patent applies local quality by creating distinct functional zones within the internal electrode structure. The outer region uses smaller metal particles optimized for interface quality and withstand voltage at the dielectric electrode boundary, while the central region uses larger particles optimized for bulk connectivity. This spatial differentiation allows thin dielectric layers to maintain both high capacitance density and adequate withstand voltage characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves electrode connectivity to 90% or more and enhances withstand voltage characteristics, maintaining high capacitance and preventing electrode aggregation, thus addressing the limitations of existing technologies.
Implementation Method 1
sintering the ceramic multilayer body to form a ceramic body including dielectric layers and internal electrodes
Implementation Method 2
as a size of the material has decreased, sintering shrinkage suppressing capability may be decreased
Data Source
AI summary
A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes a ceramic body including dielectric layers, and internal electrodes alternately disposed on the dielectric layers and containing a ceramic additive disposed therein; and external electrodes formed on an outer portion of the ceramic body and electrically connected to the internal electrodes. The ceramic additive is disposed in the internal electrode at a position spaced apart from a boundary between the internal electrode and the dielectric layer by a predetermined distance.