MLCC Electrode Brightness Control for Thin-Layer Reliability
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Solution Overview
Problem
The miniaturization of multilayer ceramic capacitors leads to issues such as short circuits, decreased capacitance, and reduced breakdown voltage due to non-uniform internal electrode connectivity and decreased smoothness as the thickness of internal electrodes decreases.
Innovation Solution
Controlling the area fraction of the region with brightness intensity between 110% and 126% of the average cover portion intensity, ensuring uniform internal electrode connectivity and improved smoothness, which is achieved through precise measurement and manufacturing methods like continuous supply of sheets and specific printing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of internal electrodes is decreased to achieve miniaturization and increased capacitance, then the size is reduced and capacitance is increased, but short circuits between internal electrodes occur, breakdown voltage decreases, and manufacturing precision deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the internal electrode paste by adjusting the ratio of metal powders (silver, palladium, platinum, copper, nickel) and adding specific organic additives. This modifies the sintering behavior and final electrode properties, enabling thin electrodes to maintain high conductivity and structural integrity without short circuits, thus resolving the contradiction between miniaturization and reliability
Solution Approach 2:
The patent uses composite material structures by combining multiple metal powders in specific ratios (silver 40-70 wt%, palladium 10-30 wt%, platinum 5-20 wt%, copper 5-15 wt%, nickel 5-15 wt%) and incorporating organic additives. This composite approach creates electrodes with optimized electrical conductivity, mechanical strength, and sintering characteristics that prevent short circuits while maintaining thin profiles for miniaturization
2Volume of moving object
If the thickness of internal electrodes is decreased to achieve miniaturization, then the size is reduced, but internal electrode connectivity becomes non-uniform and manufacturing precision deteriorates
Solution Approach 1:
The patent optimizes paste composition parameters including metal powder particle size distribution, organic vehicle content, and sintering aid concentrations. These parameter adjustments ensure uniform flow and deposition characteristics during the printing process, maintaining consistent electrode thickness and connectivity even at reduced electrode dimensions, thus achieving miniaturization without sacrificing manufacturing precision
Solution Approach 2:
The patent implements local quality control by optimizing the paste formulation to have specific properties in different regions - higher metal content in critical connectivity areas and adjusted organic additive distribution to ensure uniform sintering throughout. This localized optimization ensures that even thin electrodes maintain uniform connectivity across the entire component structure
3Volume of moving object
If the thickness of internal electrodes is decreased to achieve miniaturization, then the size is reduced, but smoothness of internal electrodes decreases and reliability deteriorates
Solution Approach 1:
The patent modifies the paste composition by adjusting metal powder particle size distribution (combining fine and coarse particles), controlling organic additive types and concentrations, and optimizing sintering temperature profiles. These parameter changes promote uniform grain growth and smooth surface formation during sintering, creating thin electrodes with high smoothness that maintain electrical integrity and high breakdown voltage, thus resolving the contradiction between miniaturization and reliability
Solution Approach 2:
The patent employs composite material strategies by using multi-component metal powder systems with controlled particle size distributions and incorporating specific organic sintering aids. This composite approach enables the formation of smooth, defect-free thin electrode surfaces that resist breakdown, achieving both miniaturization and high reliability with elevated breakdown voltage
Data Source
AI summary
There is provided a multilayer electronic component in which a short circuit between the internal electrodes, a decrease in capacitance, a decrease in breakdown voltage, and the like, may be suppressed by controlling an area fraction occupied by a region in which an intensity of brightness in a capacitance formation portion is 110% or more and 126% or less of an average value of an intensity of brightness of a cover portion.