Multilayer Ceramic Capacitor Composition for Fracture Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with fracture, chipping, and reduced high-temperature load reliability due to internal electrode layer bending and short-circuiting, particularly when the dielectric ceramic layer is thinner and the number of layered components increases.
Innovation Solution
A multilayer ceramic capacitor design featuring dielectric ceramic layers composed of Ba, Ti, Mn, a rare earth element, and Si, with specific peak intensity ratios of Mn/Ti, rare earth element/Ti, and Si/Ti in the outer layer portions, and the use of a zero-height-difference sheet manufacturing method to prevent height differences and ensure reliable electrode connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the dielectric ceramic layer is made thinner and the number of layered components is increased, then the capacitance is improved, but the internal electrode layer bends and short-circuiting occurs
Solution Approach 1:
The patent applies parameter changes by optimizing the chemical composition of the dielectric ceramic layer, specifically controlling the ratios of Ba, Ti, Mn, rare earth elements, and Si to achieve the desired capacitance while maintaining structural stability and preventing electrode bending and short-circuiting
Solution Approach 2:
The patent uses composite materials by incorporating multiple elements (Ba, Ti, Mn, rare earth elements, and Si) in the dielectric ceramic layer to create a material with optimized electrical and mechanical properties that prevent short-circuiting while achieving high capacitance
2Quantity of substance
If the internal electrode layer is made smaller in area, then the capacitance is improved, but the height difference causes bending and reliability reduction
Solution Approach 1:
The patent changes the compositional parameters of the dielectric ceramic layer to adjust its mechanical properties and shrinkage characteristics, ensuring that the height difference between the internal electrode layer and dielectric ceramic layer is minimized, thereby preventing bending and maintaining alignment precision
3Quantity of substance
If the number of layered internal electrode layers and dielectric ceramic layers is increased, then the capacitance is improved, but the occurrence of fracture and chipping increases
Solution Approach 1:
The patent employs composite materials with optimized composition ratios of Ba, Ti, Mn, rare earth elements, and Si to enhance the mechanical strength and fracture resistance of the dielectric ceramic layer, allowing for increased layering without compromising structural integrity
Solution Approach 2:
The patent optimizes the compositional parameters of the dielectric ceramic layer to improve its mechanical properties, including fracture resistance and chip resistance, enabling the manufacturing of multi-layer structures with high capacitance and enhanced durability
Data Source
AI summary
An Mn/Ti peak intensity ratio in a dielectric ceramic layer in an end surface outer layer portion is within two times to fifteen times of the Mn/Ti peak intensity ratio in a central portion, a rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the end surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio in the central portion, an Si/Ti peak intensity ratio in the dielectric ceramic layer in a side surface outer layer portion is within two times to five times the Si/Ti peak intensity ratio in the central portion, and the rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the side surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio.