Multilayer Capacitor Conductive Resin Electrode Bonding
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Solution Overview
Problem
Multilayer capacitors face limitations in securing high reliability due to low electrical and mechanical bonding strength between the conductive resin layer and internal electrodes, leading to crack generation and increased equivalent series resistance (ESR) under mechanical and thermal stress.
Innovation Solution
The use of conductive resin layers with metal particles and intermetallic compounds as primary external electrodes, which improve bonding strength and reduce ESR by forming conductive connecting portions that surround metal particles, enhancing electrical conductivity and mechanical bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sintered electrode layer is used to secure electrical and mechanical bonding strength, then bonding strength is improved, but crack generation occurs due to the sintered electrode layer
Solution Approach 1:
The patent employs a composite conductive resin layer comprising metal particles (such as copper, nickel, or silver), resin material, and intermetallic compounds formed at the interface with internal electrodes. This composite structure combines the electrical conductivity of metal particles with the mechanical flexibility and stress-absorbing properties of the resin matrix, achieving both strong bonding and crack resistance without relying on brittle sintered electrode layers.
2Device complexity
If the conductive resin layer is formed directly on the internal electrode without a sintered electrode layer, then device complexity is reduced, but electrical and mechanical bonding strength decreases
Solution Approach 1:
The patent modifies the composition and microstructure of the conductive resin layer by incorporating specific metal particles, resin materials, and intermetallic compounds. The metal particles provide conductive pathways while the resin matrix ensures mechanical adhesion. Intermetallic compounds formed at the interface enhance bonding strength. This parameter optimization allows the conductive resin layer to directly bond to internal electrodes with sufficient strength, eliminating the need for intermediate sintered electrode layers.
3Ease of manufacture
If the conductive resin layer has low electrical and mechanical bonding strength, then manufacturing is easier, but equivalent series resistance increases and reliability decreases
Solution Approach 1:
The conductive resin layer is designed as a composite material system where metal particles (copper, nickel, silver) provide electrical conductivity pathways to reduce ESR, while the resin matrix ensures mechanical adhesion and flexibility. The combination of these materials with appropriate proportions and distributions achieves both ease of manufacture and high reliability with low ESR.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the electrical and mechanical bonding strength, decreases ESR, and improves the reliability of multilayer capacitors by effectively absorbing tensile stress and preventing crack generation during mounting.
Implementation Method 1
technology using a conductive resin layer in an external electrode to absorb tensile stress generated in a mechanical or thermal environment has been disclosed to prevent generation of cracks due to the tensile stress
Implementation Method 2
conductive connecting portions surrounding the plurality of metal particles and in contact with the intermetallic compounds
Implementation Method 3
Intermetallic compounds may be in the first and second groove portions and connected to the end portions of the first and second internal electrodes, respectively
Data Source
AI summary
A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.