Multilayer Ceramic Capacitor Copper-Nickel Alloy Interface
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Solution Overview
Problem
Multilayer ceramic capacitors face reliability issues due to interface separation phenomena between the conductive resin layer and the plating layer, particularly during mounting on a substrate, which affects their performance and reliability, especially in high-reliability applications.
Innovation Solution
A multilayer ceramic capacitor design that includes a copper-nickel alloy layer with a thickness of 1 to 10 nm between the conductive resin layer and the nickel plating layer, enhancing the adhesive force and preventing interface separation, along with a method of manufacturing that involves forming internal electrodes, dielectric layers, and applying a conductive resin composition containing copper powder and a thermo-setting resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer is applied between the electrode layer and the plating layer to absorb external impacts and prevent infiltration of the plating solution, then reliability is improved, but interface separation phenomenon is generated between the conductive resin layer and the plating layer
Solution Approach 1:
A copper-nickel alloy layer is introduced as an intermediary between the conductive resin layer containing copper powder and the nickel plating layer. This alloy layer acts as a mediator that prevents interface separation by providing a transition zone that is chemically and mechanically compatible with both adjacent layers, thereby maintaining reliability while eliminating the interface separation problem
Solution Approach 2:
The invention uses a composite copper-nickel alloy layer combining properties of both copper and nickel. This composite material provides both the electrical conductivity needed for the external electrode and the adhesion properties required to bond the conductive resin layer and the nickel plating layer, resolving the interface separation issue while maintaining overall reliability
2Object-affected harmful factors
If the conductive resin layer is applied to improve reliability, then infiltration of plating solution is prevented, but interface separation is frequently generated during mounting process
Solution Approach 1:
The copper-nickel alloy layer serves as a mediator that eliminates interface separation during the mounting process. It provides a stable transition zone between the conductive resin and nickel plating layers, ensuring that no separation occurs even under the thermal and mechanical stresses of mounting operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper-nickel alloy layer effectively prevents interface separation, improving the reliability and thermal stability of the multilayer ceramic capacitor, as demonstrated by the soldering bath test results, ensuring stable performance under thermal impact.
Implementation Method 1
a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer... enhancing the adhesive force and preventing interface separation
Implementation Method 2
a resin composition containing a conductive material may be applied between an electrode layer of the external electrode and the plating layer to absorb external impacts
Implementation Method 3
to absorb external impacts and prevent infiltration of the plating solution, thereby improving reliability
Data Source
AI summary
There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.