MLCC Side Margin Corner Densification for Crack Resistance
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Solution Overview
Problem
Multi-layer ceramic electronic components are prone to cracks and damage in corner portions of side margins due to external impacts, leading to insulation degradation and reduced reliability, especially when side margins are thinned.
Innovation Solution
The side margins of the multi-layer ceramic electronic component are designed with corner portions having a lower porosity than the center portions, and the corner portions are densified through pressure treatment to enhance mechanical strength and moisture resistance, while maintaining a thin thickness to ensure a small size and large capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If side margins are thinned to increase intersectional area of internal electrodes, then device size is reduced and capacitance is increased, but mechanical strength and moisture resistance deteriorate leading to cracks and damage in corner portions
Solution Approach 1:
The patent applies local quality by creating a density gradient within the side margin structure. The corner portions are designed with higher density (lower porosity) compared to the center portion, making them more resistant to cracks and damage. This localized differentiation of material properties allows the side margins to be thinner overall while maintaining strength at critical locations where stress concentrates.
2Volume of moving object
If side margins are thinned to increase intersectional area of internal electrodes, then device size is reduced and capacitance is increased, but moisture resistance deteriorates leading to insulation degradation
Solution Approach 1:
The patent implements local quality by making the corner portions of side margins denser (lower porosity) than the center portions. Since corner portions are more susceptible to moisture penetration and insulation degradation, this localized density enhancement provides better moisture resistance and maintains insulation resistance at critical locations while allowing the overall side margin thickness to be reduced.
3Ease of manufacture
If uniform density is maintained throughout side margins, then manufacturing is simplified, but corner portions remain vulnerable to cracks and damage from external impacts
Solution Approach 1:
The patent resolves this contradiction by applying local quality through a two-stage pressing process. The first pressing applies uniform pressure to form the basic green chip structure, while the second pressing selectively applies additional pressure to corner portions to increase their density. This approach maintains reasonable manufacturing simplicity while significantly improving the damage resistance of corner portions.
Solution Approach 2:
The patent uses preliminary action by performing a first pressing operation to form the green chip structure before conducting a second pressing operation that specifically densifies the corner portions. This sequential approach allows the corner portions to be strengthened in advance before final sintering, ensuring they are pre-prepared to withstand external impacts and mechanical stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses cracks and damage from external impacts, enhances mechanical strength and moisture resistance, and improves the reliability of the multi-layer ceramic electronic component by reducing insulation degradation.
Implementation Method 1
the corner portions are densified through pressure treatment to enhance mechanical strength and moisture resistance
Data Source
AI summary
A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, and internal electrodes disposed between the ceramic layers, positions of end portions of the internal electrodes in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 μm in the second direction. The side margin includes a center portion in the first direction and a third direction orthogonal to the first direction and the second direction, and corner portions in the first direction and the third direction, the corner portions having a lower porosity than a porosity of the center portion, the side margin covering the multi-layer unit from the second direction.