Multilayer Ceramic Component Corner Holes for Moisture and Mounting Reliability
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Solution Overview
Problem
As multilayer ceramic electronic components miniaturize, the decreasing thickness of external electrodes compromises their reliability and durability, leading to issues with waterproof reliability and mounting defects.
Innovation Solution
The design includes external electrodes with base electrode layers and plating layers that have optimized hole sizes at the corners of the ceramic body, preventing holes from extending to certain edges, which enhances the structural reliability and moistureproof reliability while maintaining a thin profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of external electrodes is decreased to achieve miniaturization, then the size of the multilayer ceramic electronic component is reduced, but the reliability and durability of the external electrode deteriorate
Solution Approach 1:
The patent applies local quality by creating holes at specific corner regions of the external electrode while maintaining the overall thin profile. The holes are positioned at four corners of the ceramic body, extending from the end surface toward the side surface but stopping before reaching it. This localized structural modification allows the electrode to remain thin for miniaturization while the corner holes provide stress relief and prevent cracking, thus maintaining reliability and durability.
2Volume of moving object
If the thickness of external electrodes is decreased, then the component size is reduced, but water proof reliability deteriorates
Solution Approach 1:
The patent addresses water proof reliability by introducing holes at the corner regions where moisture penetration is most likely to occur. These holes are strategically positioned to extend from the end surface toward the side surface at the corners, creating a barrier effect that prevents moisture from penetrating along the electrode-ceramic interface. The holes stop before reaching the side surface to maintain electrode integrity while effectively blocking moisture pathways, thus improving water proof reliability in thin-profile components.
3Volume of moving object
If the thickness of external electrodes is decreased, then the component size is reduced, but mounting defective rate increases
Solution Approach 1:
The patent reduces mounting defective rate by introducing holes at the corner regions of the external electrode. These holes are positioned to extend from the end surface toward the side surface but stop before reaching it, creating localized stress relief zones. This prevents cracking and deformation during the mounting process, ensuring that the thin external electrode maintains its structural integrity and positioning accuracy, thus reducing mounting defects in miniaturized components.
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending ina thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.