MLCC Reinforcing Pattern Layout for Moisture-Resistant Corners
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors face issues with moisture resistance reliability due to thin external electrodes at the corners, which can lead to moisture penetration, and structural weaknesses such as step differences and clumping during the stacking and heat treatment processes.
Innovation Solution
A multilayer electronic component design featuring reinforcing patterns on the capacitance formation portion, with specific length variations in the second direction, to enhance moisture resistance and alleviate step differences by ensuring adequate thickness and connectivity of external electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If external electrodes are formed thin at the corners to reduce size, then miniaturization is achieved, but moisture resistance reliability deteriorates
Solution Approach 1:
The external electrode is designed with non-uniform thickness, being thicker at the corner portions and thinner at the center portions. This local quality variation ensures that the corner portions maintain sufficient thickness for moisture resistance while the center portions are minimized for compactness. The reinforcing pattern is also applied selectively at corner portions to enhance local structural integrity without increasing overall component size.
Solution Approach 2:
A reinforcing pattern is formed on the external electrode at the corner portions before final assembly and testing. This preliminary reinforcement prevents moisture penetration and structural degradation at the most vulnerable locations (corners) during subsequent manufacturing processes and service life, addressing the reliability issue before it manifests.
2Quantity of substance
If internal electrodes are stacked to form capacitance formation portion, then capacitance is increased, but step difference occurs during stacking and compressing process
Solution Approach 1:
The reinforcing pattern is applied specifically at the corner portions of the external electrode, creating a localized structural enhancement. This local reinforcement compensates for the step difference that occurs at the boundaries between the capacitance formation portion and margin portions during stacking and compressing, without affecting the overall capacitance formation.
Solution Approach 2:
The reinforcing pattern acts as a compensatory structure that anticipates and mitigates the step difference problem before it causes manufacturing defects. By pre-reinforcing the corner portions, the structure can better withstand the compressive forces during stacking and compressing processes, preventing excessive step differences and improving manufacturing precision.
3Quantity of substance
If internal electrodes overlap in center region, then capacitance formation is achieved, but clumping phenomenon occurs during heat treatment process
Solution Approach 1:
The reinforcing pattern is strategically placed at the corner portions rather than the center region where internal electrodes overlap. This localized reinforcement approach strengthens the most vulnerable areas (corners) without interfering with the capacitance formation process in the center region, preventing clumping while maintaining capacitance.
Solution Approach 2:
The external electrode is functionally segmented into different regions: corner portions receive reinforcing patterns for structural stability, while center portions maintain the capacitance formation structure. This segmentation allows each region to be optimized for its specific function without compromising the other, preventing clumping in the center while reinforcing corners.
Data Source
AI summary
A multilayer electronic component includes a body including a plurality of dielectric layers, internal electrodes, and a reinforcing pattern and an external electrode on the body. The internal electrodes are disposed alternately with the dielectric layer therebetween in the first direction. The reinforcing pattern is disposed on surfaces of a capacitance formation portion in the first direction. The reinforcing pattern contacts a surface of the body in a second direction. The reinforcing pattern includes four parts in a third direction from one end to the other end in the third direction. A length of the reinforcing pattern at a ¼ point in the second direction is greater than a length thereof at a ½ point in the second direction and a length thereof at a ¾ point in the second direction is greater than the length thereof at the ½ point in the second direction.