MLCC Cover Structure for Crack-Resistant Miniaturization
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Solution Overview
Problem
There is a need for a multilayer ceramic capacitor (MLCC) design that miniaturizes the component while preventing chipping and cracks to ensure reliability and achieve the required capacitance.
Innovation Solution
The design includes a body with a capacitance formation portion featuring a dielectric layer and internal electrodes alternately disposed, covered by a cover portion on both surfaces, and side margin portions on width-wise surfaces, with external electrodes on length-wise surfaces. The dimensions and thicknesses of these components are carefully optimized to ensure miniaturization and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the MLCC size is reduced to achieve miniaturization, then the component size decreases, but the vulnerability to chipping and cracks increases
Solution Approach 1:
The MLCC body is divided into distinct functional regions: a capacitance formation portion containing dielectric layers and internal electrodes, and cover portions at both ends. This segmentation allows the cover portions to act as protective structures that reinforce the edges and prevent chipping, while the capacitance formation portion maintains the required electrical performance in a compact size.
Solution Approach 2:
The cover portions are designed to extend beyond the edges of the capacitance formation portion, creating a protective buffer zone before mechanical stress can reach the vulnerable internal structure. This beforehand cushioning prevents external impacts from directly contacting the dielectric layers and internal electrodes, thereby preventing chipping and cracks in miniaturized components.
2Reliability
If the thickness of the MLCC is increased to achieve required capacitance, then the capacitance increases, but the component thickness exceeds the 0.5 mm limit for miniaturized devices
Solution Approach 1:
The patent optimizes multiple parameters simultaneously: the thickness of dielectric layers, the dimensions and arrangement of internal electrodes, and the number of alternating layers. By carefully adjusting these parameters, the design achieves the required capacitance value while maintaining the total thickness within the 0.5 mm limit. The cover portions are also designed with specific thickness ratios to balance protection and overall size constraints.
3Volume of moving object
If the MLCC is miniaturized to fit small IT products, then the component size decreases, but the edge becomes more vulnerable to damage
Solution Approach 1:
The MLCC is segmented into a capacitance formation portion and cover portions, where the cover portions specifically address the edge strength problem by extending beyond the capacitance formation region. This segmentation allows the edges to be reinforced without increasing the overall footprint of the component, maintaining miniaturization while improving edge strength.
Solution Approach 2:
The cover portions create a protective buffer zone that cushions external impacts before they can reach the vulnerable edges of the capacitance formation portion. This beforehand cushioning is particularly effective in miniaturized components where the absolute size of protective features must be minimized while still providing adequate protection.
Data Source
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AI summary
A multilayer electronic component includes a body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the body including a capacitance formation portion including a dielectric layer and an internal electrode, and a cover portion, and an external electrode. When maximum sizes of the multilayer electronic component in the first tothird directions are L, W and T, respectively, average sizes of the cover portion, dielectric layer, and internal electrode in the first direction are tc, td, and te, respectively, 0.75 mm ≤ L ≤ 1.25 mm, 0.25 mm ≤ W ≤ 0.75 mm, T < 0.5 mm, 28 um ≤ tc ≤ 34 µm, 0.4 µm ≤ td ≤ 0.5 µm, and 0.4 µm ≤ te ≤ 0.5 µm are satisfied.