MLCC Cover Layer Structure for Strength and Low ESL
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving high flexural strength, adhesion strength, and reduced equivalent series inductance (ESL) while maintaining miniaturization and high capacitance, especially in automotive electronic components where reliability and impact resistance are critical.
Innovation Solution
A multilayer electronic component design featuring a body with dielectric layers and internal electrodes, external electrodes, and a cover layer with insulating and conductive portions made of conductive metal and resin, which enhances flexural strength, adhesion, and reduces ESL by forming a current path on the band portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of multilayer ceramic capacitors is reduced to achieve miniaturization, then the component can be mounted in compact electronic devices, but the flexural strength and impact resistance deteriorate
Solution Approach 1:
The cover layer is constructed as a composite material comprising both insulating material and conductive material, combining the mechanical protection function with electrical functionality. This composite structure enhances flexural strength and impact resistance while maintaining miniaturization, as the conductive material provides structural reinforcement without significantly increasing size.
Solution Approach 2:
The cover layer serves multiple functions simultaneously: it provides mechanical protection (insulating function), establishes electrical connections (conductive function), and enhances structural strength. By integrating these functions into a single component, the design improves flexural strength and impact resistance without requiring additional separate components that would increase size.
2Strength
If a cover layer is added to improve flexural strength, then the structural integrity is enhanced, but the device complexity increases
Solution Approach 1:
The cover layer is designed to perform multiple functions simultaneously: mechanical protection, electrical insulation, and electrical connection. By integrating these functions into a single component rather than using separate parts, the design enhances flexural strength without proportionally increasing device complexity.
Solution Approach 2:
The insulating function and conductive function are merged into a single cover layer component. Instead of using separate insulating and conductive elements, the patent combines both functionalities in one integrated structure, simplifying the overall device architecture while maintaining enhanced mechanical strength.
3Strength
If the cover layer includes both insulating and conductive portions, then the adhesion strength between substrates is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The cover layer is formed to extend onto the band portions of external electrodes during the manufacturing process, establishing electrical connections in advance. This preliminary positioning of conductive portions ensures proper adhesion strength while allowing for standard manufacturing tolerances, as the extension design provides a margin for alignment.
4Reliability
If the conductive portions are extended onto band portions, then the equivalent series inductance is reduced, but the manufacturing complexity increases
Solution Approach 1:
The cover layer formation process is merged with the external electrode formation process. The conductive portions are formed as an integral part of the cover layer structure, extending onto the band portions during the same manufacturing sequence, which reduces ESL without requiring separate additional manufacturing steps.
Data Source
AI summary
A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.