MLCC Cover Layer Composition for Anti-Static Peeling Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors face issues with static electricity generation during the peeling of cover portion patterns, leading to folding and wrinkle defects, which can cause a decrease in withstand voltage and short circuit failures. Additionally, there is a need to improve moisture resistance reliability by enhancing the density and toughness of the cover portions.
Innovation Solution
Incorporating fluorine (F) into the cover portions and adjusting the average size of dielectric grains in the cover portions relative to those in the dielectric layer, such that A2>A1, to improve sintering density and toughness. The method involves using a ceramic slurry with a fluorine-based compound and specific dielectric materials like BaTiO3 to form the cover portions during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the cover portion pattern is peeled from the carrier film, then the cover portion is formed, but static electricity is generated causing folding and wrinkle defects
Solution Approach 1:
A release film is introduced as an intermediary carrier between the carrier film and the cover portion pattern. The release film allows the cover portion pattern to be peeled without direct contact with the carrier film, thereby preventing static electricity generation and associated defects while maintaining the manufacturing process
Solution Approach 2:
The patent replaces the direct mechanical peeling process that generates static electricity with a modified process using a release film. This substitution eliminates the harmful mechanical interaction between the carrier film and cover portion pattern during peeling, preventing folding and wrinkle defects
2Reliability
If the cover portion density and toughness are increased, then moisture resistance reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent changes the chemical composition parameters of the cover portion by adding specific amounts of Al2O3 (1-10 wt%) and TiO2 (1-10 wt%) to the ceramic slurry. These parameter changes enhance the density and toughness of the cover portion, improving moisture resistance reliability without significantly complicating the manufacturing process
Solution Approach 2:
The patent creates a composite material system for the cover portion by combining multiple ceramic components (BaTiO3, Al2O3, TiO2) in specific proportions. This composite approach achieves enhanced density and toughness through material synergies while maintaining a relatively simple manufacturing process using conventional ceramic slurry preparation and sintering
3Productivity
If the size of the multilayer ceramic capacitor is reduced, then higher capacitance density is achieved, but the component becomes more susceptible to impact and moisture
Solution Approach 1:
The patent applies local quality enhancement by specifically improving the cover portion (the outer protective layer) with enhanced density and toughness through added Al2O3 and TiO2. This localized strengthening of the cover portion provides impact and moisture protection without increasing the overall component size, allowing high capacitance density to be maintained
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of fluorine in the cover portions effectively reduces static electricity-induced defects, enhances the density and toughness of the cover portions, and improves the moisture resistance reliability of the multilayer ceramic capacitors, thereby preventing decreases in withstand voltage and short circuit failures.
Implementation Method 1
static electricity may be generated due to friction and/or an energy level difference between materials
Implementation Method 2
a sintering process of sintering the stack body to obtain the body
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.