Multilayer Ceramic Capacitor Structure for Crack-Resistant Miniaturization

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Solution Overview

Problem

Existing multilayer ceramic capacitors face challenges in miniaturization as thin side gap portions tend to lead to cracks in ridge line and corner portions.

Innovation Solution

The solution involves a multilayer ceramic capacitor design where the thickness of the side gap portion (W1) and the outer layer portion (T1) are maintained in a specific relationship, with W1 and T1 being about 20 μm or less, and satisfying the condition 0.1 < |(W1-T1)|/T1 < 0.3, to prevent cracks during miniaturization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the side gap portions are made thin to enable miniaturization, then the capacitor size is reduced, but cracks easily occur in ridge line and corner portions

Engineering Contradiction:
Improvecapacitor sizeVSAvoidcrack resistance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The invention changes the thickness parameter of the outer layer portion (T1) to be 10 μm or less, creating a thin outer layer that prevents crack propagation while maintaining the miniaturized size. This parameter change resolves the contradiction by allowing thin side gap portions without compromising reliability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The thin outer layer portion acts as a protective cushion that prevents cracks from forming and propagating in the ridge line and corner portions before they can cause failure. This beforehand protection enables the use of thin side gap portions without reliability concerns

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS12272498B2Multilayer ceramic capacitor
Publication Date: 2025.04.08 MURATA MFG CO LTD
  • US12272498B2 patent drawing
  • US12272498B2 patent drawing
  • US12272498B2 patent drawing

AI summary

A multilayer ceramic capacitor includes a multilayer body including a laminate chip and side gap portions. The laminate chip includes an inner layer portion in which dielectric layers and internal electrode layers are alternately laminated, and outer layer portions respectively on both sides of the inner layer portion in a lamination direction. Side gap portions are on both sides of the laminate chip in a width direction. The multilayer ceramic capacitor further includes external electrodes respectively on both sides of the multilayer body in a length direction. When a thickness of one of the outer layer portions is defined as T1, and a thickness of one of the side gap portions is defined as W1, W1 and T1 are about 20 μm or less, and about 0.1&lt;|(W1-T1)|/T1&lt;about 0.3 is satisfied.