Multilayer Ceramic Capacitor Ridges with Curved Geometry

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Solution Overview

Problem

Multilayer ceramic capacitors face chipping issues due to a decrease in side margin portion thickness, which reduces the radius of curvature and increases the likelihood of chipping at the ridgeline portion.

Innovation Solution

The design includes a multilayer ceramic capacitor with a specific structure where the variation in distance from the straight line connecting outermost internal electrodes is limited, and the ridgeline portions have distinct curvatures, with a larger radius of curvature for the first ridgeline portion compared to the second, reducing chipping risks even with a thinner side margin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the thickness of the side margin portion is decreased, then the capacitance efficiency is improved, but the radius of curvature of the ridgeline portion becomes smaller and chipping is more likely to occur

Engineering Contradiction:
Improvecapacitance efficiencyVSAvoidresistance to chipping
Core Design Contradiction:
Quantity of substanceVSStrength

Solution Approach 1:

The patent applies curvature to the ridgeline portion by forming a rounded surface with a specified radius of curvature (R1) that is larger than the thickness of the side margin portion. This curved geometry redistributes mechanical stresses away from sharp corners, significantly reducing the likelihood of chipping while allowing the side margin to be made thinner for improved capacitance efficiency.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent differentiates the curvature radius at different locations: the ridgeline portion has a larger radius of curvature (R1) compared to other portions (R2). This localized quality optimization ensures that the critical ridgeline area has enhanced chipping resistance through increased curvature, while other areas maintain their original dimensions for optimal electrical performance.

Inventive Principle:
Principle #3Local quality

2Volume of moving object

If the side margin portion thickness is reduced, then the overall device size is minimized, but the structural integrity at the ridgeline portion deteriorates

Engineering Contradiction:
Improvedevice sizeVSAvoidstructural integrity
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

By forming the ridgeline portion with a rounded surface having a radius of curvature (R1) larger than the side margin thickness, the patent eliminates sharp corners that would act as stress concentration points. This curvature transformation maintains structural integrity even when the side margin is minimized, allowing compact device design without compromising stability.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent proactively designs the ridgeline with enhanced curvature before any mechanical stress is applied. This preemptive geometric modification creates a cushioning effect that absorbs and distributes mechanical loads, preventing structural failure at the ridgeline portion before it can occur during device operation or handling.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Length of stationary object

If the ridgeline portion has a small radius of curvature, then the side margin thickness is reduced, but chipping resistance deteriorates

Engineering Contradiction:
Improveside margin thicknessVSAvoidchipping resistance
Core Design Contradiction:
Length of stationary objectVSStrength

Solution Approach 1:

The patent resolves this contradiction by specifying that the ridgeline portion shall have a radius of curvature (R1) that is explicitly larger than the side margin thickness. This inverted approach uses increased curvature at the critical ridgeline location to protect against chipping, while the side margin itself remains thin for miniaturization. The curved geometry creates a stress-distributing profile that prevents chipping despite the reduced overall dimension.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent applies different curvature characteristics to different portions: the ridgeline portion has a larger radius of curvature (R1) for chipping resistance, while other portions have a smaller radius (R2). This localized differentiation allows the side margin to be thin for size reduction while the critical ridgeline area maintains enhanced structural strength through optimized curvature.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11398353B2Multilayer ceramic capacitor
Publication Date: 2022.07.26 MURATA MFG CO LTD
  • US11398353B2 patent drawing
  • US11398353B2 patent drawing
  • US11398353B2 patent drawing

AI summary

In a multilayer ceramic capacitor, when a cross-section obtained by cutting a multilayer body at a position at a central portion in a length direction and defined in a width direction and a layering direction is viewed, a variation in distance in the width direction from a straight line that connects ends of two internal electrodes located outermost in the layering direction to each other to respective ends of internal electrodes is not larger than about 0.2, a first ridgeline portion connecting the straight line that connects the ends of the two internal electrodes to each other to one main surface of the multilayer body has a first curve, a second ridgeline portion that connects one main surface to one side surface of the multilayer body has a second curve, and the first curve is larger in radius of curvature than the second curve.