Multilayer Ceramic Component Dielectric Thickness Optimization
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Solution Overview
Problem
Multilayer ceramic electronic components are vulnerable to dielectric breakdown due to the thinning and atomization of dielectric layers, which compromises their reliability and capacitance.
Innovation Solution
A multilayer ceramic electronic component design featuring dielectric layers with a thickness of 3.5 micrometers or more to 3.7 micrometers or less, and internal electrodes alternately laminated with dielectric layers, which enhances the component's ability to suppress dielectric breakdown without significantly increasing the overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If dielectric layers are thinned and atomized to increase stacking number per unit thickness, then capacitance is improved, but dielectric breakdown resistance deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the dielectric layer thickness within a specific range (3.5-3.7 micrometers) rather than simply minimizing it. This optimized thickness parameter achieves a balance between maintaining sufficient dielectric strength to prevent breakdown and enabling increased stacking density for higher capacitance.
Solution Approach 2:
The patent applies local quality by ensuring uniform dielectric layer thickness through controlled formation processes. The consistent local quality of the dielectric layer prevents weak points that could lead to breakdown, while maintaining the optimized thickness throughout the structure to maximize capacitance density.
2Reliability
If dielectric layer thickness is increased to suppress dielectric breakdown, then reliability is improved, but component thickness increases
Solution Approach 1:
The patent resolves this contradiction by identifying and implementing an optimal dielectric layer thickness parameter (3.5-3.7 micrometers) that provides sufficient breakdown resistance without excessive thickness. This precise parameter optimization allows the component to achieve high reliability while maintaining compact dimensions.
Solution Approach 2:
The patent applies segmentation by increasing the number of dielectric layers (stacking number) within the compact thickness constraint. By dividing the total capacitance into multiple thinner layers rather than using fewer thicker layers, the design achieves both compact overall thickness and adequate dielectric strength through the cumulative effect of multiple optimized layers.
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.