Multilayer Ceramic Capacitor Dielectric Mix for High-Temperature Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in achieving high-temperature withstand voltage properties and reliability due to a single composition of dielectric grains, which limits their performance in high-temperature applications and capacitance stability over time.
Innovation Solution
The multilayer electronic component incorporates a dielectric layer with a mixture of first and second grains, each having different Ti content ratios, specifically (Ca1-xSr x )(Zr1-yTi y )O3, where the first grain has a low Ti fraction (0 ≤ y ≤ 0.050) and the second grain has a high Ti fraction (1 ≥ y ≥ 0.600), enhancing withstand voltage and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single composition of dielectric grains is used, then the manufacturing process is simplified, but the high-temperature withstand voltage properties and reliability deteriorate
Solution Approach 1:
The patent applies local quality by creating a dielectric layer with non-uniform composition: first grains with low Ti content (0 ≤ y ≤ 0.050) and second grains with high Ti content (0.600 ≤ y ≤ 1.0). This spatial variation in composition allows different regions to contribute different properties - the low-Ti grains provide high dielectric constant while the high-Ti grains enhance withstand voltage and reliability, resolving the contradiction between manufacturing simplicity and high-temperature performance.
Solution Approach 2:
The patent uses composite materials by combining two types of CSZT grains with different Ti content ratios in the same dielectric layer. This composite structure integrates the advantages of both compositions: the paraelectric properties of low-Ti grains (high dielectric constant, temperature stability) and the piezoelectric properties of high-Ti grains (high withstand voltage, reliability), thereby achieving improved high-temperature withstand voltage properties while maintaining a feasible manufacturing process through mixed powder formulation.
2Quantity of substance
If the Ti content is increased to improve dielectric constant, then the capacitance increases, but the withstand voltage properties and reliability decrease
Solution Approach 1:
The patent applies local quality by spatially distributing different Ti content grains within the dielectric layer. Low-Ti grains (0 ≤ y ≤ 0.050) provide high dielectric constant and capacitance, while high-Ti grains (0.600 ≤ y ≤ 1.0) provide high withstand voltage and reliability. This local differentiation allows the material to simultaneously exhibit both high capacitance and high withstand voltage properties that cannot be achieved with a single uniform composition.
Solution Approach 2:
The patent uses composite materials by formulating a mixed powder containing both low-Ti and high-Ti CSZT grains. During sintering, these form a composite dielectric layer where the low-Ti grains contribute to high dielectric constant (capacitance) and the high-Ti grains contribute to high withstand voltage and reliability. This composite approach resolves the trade-off between capacitance and withstand voltage by combining materials with complementary properties.
3Adaptability or versatility
If multiple types of powders with different Ti content are mixed to achieve various dielectric constants, then the dielectric constant can be adjusted, but the manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by systematically varying the Ti content parameter (y value) within defined ranges for two distinct grain types: low-Ti grains (0 ≤ y ≤ 0.050) and high-Ti grains (0.600 ≤ y ≤ 1.0). By controlling the ratio of these two grain types in the mixed powder, the patent achieves adjustable dielectric constants while maintaining a relatively simple binary mixing approach rather than requiring complex multi-component formulations, thus balancing adaptability with manufacturing feasibility.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, wherein the dielectric layer includes a first grain and a second grain each including a first component represented as (Ca1-xSrx) (Zr1-yTiy)O3 (0 ≤ x ≤ 1.0), wherein the first component included in the first grain satisfies 0 ≤ y ≤ 0.050, and wherein the first component included in the second grain satisfies 1 ≥ y ≥ 0.600.