Core-Dual Shell MLCC Dielectric for TCC and High-Temperature Life
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in maintaining insulation resistance due to oxygen vacancy movement during sintering in reducing atmospheres, and they require improved high-temperature lifespan characteristics and temperature coefficient of capacitance (TCC) to meet the demands of 5G technology.
Innovation Solution
A multilayer electronic component with a core-dual shell structure dielectric grain composition, including Ba, Ti, Sn, and a rare earth element, where the average molar ratios of Sn to Ti and rare earth elements to Ti in the first and second shells satisfy specific conditions, enhancing the component's high-temperature reliability and TCC characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rare earth element is added to the dielectric layer to suppress oxygen vacancy generation, then insulation resistance is improved, but high-temperature lifespan characteristics and TCC performance deteriorate
Solution Approach 1:
The patent applies local quality by creating a core-shell structure where the dielectric grain has different compositions in different regions. The core contains BaTiO3 with specific dopants, while the shell contains a different ratio of rare earth elements and other oxides. This allows the inner core to provide insulation resistance through rare earth element addition, while the outer shell composition is optimized for high-temperature stability and TCC characteristics, thus resolving the contradiction between insulation resistance and high-temperature lifespan.
Solution Approach 2:
The patent uses composite materials by combining multiple oxide components (BaTiO3, SrTiO3, PbZr1-xTixO3, and rare earth element oxides) in a core-shell structure. The composite nature allows different regions to contribute different properties: the core provides insulation through rare earth element suppression of oxygen vacancies, while the shell provides thermal stability and capacitance temperature coefficient control through its specific composite composition, thereby achieving both improved insulation resistance and high-temperature lifespan.
2Reliability
If the dielectric layer composition is optimized for room temperature permittivity, then capacitance is improved, but high-temperature stability deteriorates
Solution Approach 1:
The patent applies local quality by designing the core-shell structure where the core region is optimized for high permittivity at room temperature through specific dopant combinations, while the shell region is optimized for thermal stability. The core contains BaTiO3 with dopants that enhance permittivity, while the shell contains a controlled composition of SrTiO3, PbZr1-xTixO3, and rare earth elements that provide thermal stability, thus resolving the contradiction between room temperature capacitance performance and high-temperature stability.
Solution Approach 2:
The patent uses composite materials to achieve both high permittivity and thermal stability. The core-shell structure combines materials with different properties: the core uses BaTiO3-based composition for high permittivity, while the shell uses a composite of SrTiO3, PbZr1-xTixO3, and rare earth element oxides for thermal stability. This composite approach allows the capacitor to achieve excellent room temperature capacitance while maintaining stability at high temperatures.
3Ease of manufacture
If the dielectric layer is sintered in a reducing atmosphere to form the body, then the multilayer structure is created, but oxygen vacancies are generated causing insulation resistance deterioration
Solution Approach 1:
The patent applies preliminary anti-action by pre-doping the dielectric grains with rare earth elements before sintering. This preliminary action creates a composition that is resistant to oxygen vacancy generation during the subsequent reducing atmosphere sintering process. The rare earth elements are incorporated into the dielectric grain structure in advance, so when the reducing atmosphere sintering occurs and oxygen is released, the rare earth elements suppress oxygen vacancy formation, thus preventing insulation resistance deterioration while still allowing multilayer structure formation.
Solution Approach 2:
The patent applies preliminary action by preparing the dielectric grain composition with specific rare earth element content and core-shell structure before the sintering process. This preliminary preparation ensures that when the multilayer structure is formed through reducing atmosphere sintering, the oxygen vacancies are already suppressed by the pre-positioned rare earth elements, thus achieving both easy manufacture of multilayer structure and maintenance of insulation resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively improves the high-temperature lifespan and TCC characteristics of the multilayer electronic component, ensuring stability and performance under severe conditions, such as those encountered in 5G technology applications.
Implementation Method 1
a method of suppressing generation of oxygen vacancies by adding a rare earth element to a dielectric layer may be considered
Implementation Method 2
Such a body should be sintered in a reducing atmosphere
Implementation Method 3
when sintered in a reducing atmosphere, oxygen inside an oxide is released and oxygen vacancy and electrons may be generated
Implementation Method 4
research for a multilayer ceramic capacitor having excellent high-temperature lifespan characteristics and a temperature coefficient of capacitance (TCC) according to a temperature, is required
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer including a plurality of dielectric grains and internal electrodes alternately disposed with the dielectric layer; and an external electrode disposed on the body and connected to the internal electrodes At least one of the plurality of dielectric grains includes Ba, Ti, Sn, and a rare earth element and has a core-dual shell structure, which includes a core, a first shell disposed on at least a portion of the core, and a second shell disposed on at least a portion of the first shell. When an average molar ratio of Sn to Ti included in the first and second shells is S1 and S2, respectively, and an average molar ratio of the rare earth element to Ti included in the first and second shells is R1 and R2, respectively, S1>S2 and R2>R1 are satisfied.


