Multilayer Ceramic Component Dummy Conductor Plating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic electronic components face challenges in achieving accurate formation of external terminal electrodes at small pitches due to limitations in printing thick film paste accuracy, leading to trapezoidal-shaped electrodes that cause tombstone failures, self-alignment issues, and solder bridges.
Innovation Solution
The method involves creating a multilayer ceramic electronic component with strategically positioned dummy conductors that are electrically insulated, allowing for even pressure distribution during lamination, and using direct plating to form external terminal electrodes with straight edges by ensuring the dummy conductor patterns are not excessively widened, thus preventing electrode expansion and maintaining accurate terminal electrode formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thick film paste printing is used to form external terminal electrodes, then the manufacturing process is simple, but the accuracy of electrode formation is insufficient and trapezoidal shapes occur
Solution Approach 1:
The patent replaces the mechanical printing process with direct plating to form external terminal electrodes. Instead of using thick film paste printing which causes trapezoidal shapes and accuracy issues, the invention uses electroplating or electroless plating processes to deposit metal directly onto the exposed ends of internal electrodes and dummy conductors, achieving precise rectangular electrode shapes with straight edges and eliminating the need for paste printing alignment and drying steps
Solution Approach 2:
The patent introduces dummy conductors as intermediary elements that extend to the outer surface of the ceramic element. These dummy conductors serve as additional plating substrates that work together with internal electrodes to form the external terminal electrodes through direct plating, enabling accurate electrode formation while distributing the plating load and preventing trapezoidal deformation
2Manufacturing precision
If direct plating is used to form external terminal electrodes, then electrode accuracy is improved, but conductor patterns become uneven during lamination causing trapezoidal shapes
Solution Approach 1:
The patent applies different properties to different parts of the conductor system by introducing dummy conductors with specific characteristics. The dummy conductors are designed with controlled resistance values (higher than internal electrodes) and specific geometries, allowing them to serve as stable plating substrates that compensate for lamination-induced deformation and maintain uniform electrode dimensions throughout the stacking process
Solution Approach 2:
The patent performs preliminary design of dummy conductor patterns and their electrical properties before the lamination and plating processes. By pre-calculating and pre-designing the dummy conductor dimensions, materials, and resistance values, the system compensates in advance for the deformation that will occur during lamination, ensuring that the final plated electrodes maintain uniform dimensions and rectangular shapes
3Volume of moving object
If multilayer ceramic components are downsized, then the component size is reduced, but the effective area of internal electrodes is reduced degrading characteristics
Solution Approach 1:
The patent extends the conductor patterns from the internal layers to the outer surface of the ceramic element by adding extension portions that reach the outer surface. This dimensional extension allows the internal electrodes to maintain their effective area within the compact volume by utilizing the third dimension (depth/length toward outer surface), thereby preserving electrical characteristics while achieving component downsizing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents the formation of trapezoidal-shaped external terminal electrodes, reducing the likelihood of tombstone failures and solder bridges, and ensures reliable mounting by maintaining the accuracy and straightness of the external terminal electrodes.
Implementation Method 1
a method of forming external terminal electrodes by direct plating has been developed
Data Source
AI summary
A method of manufacturing a multilayer ceramic electronic component includes a step of preparing a first ceramic green sheet on which at least one of a first internal electrode pattern and a second internal electrode pattern are printed, a second ceramic green sheet on which at least one of a first dummy conductor pattern and a second dummy conductor pattern are printed, and a third ceramic green sheet on which at least one of a third internal electrode pattern and a fourth internal electrode pattern are printed, wherein a width of the third dummy conductor pattern is made less than a width of the first dummy conductor pattern, and a width of the fourth dummy conductor pattern is made less than a width of the second dummy conductor pattern.