MLCC Electrode Edge Structure for Adhesion and Moisture Blocking
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face challenges in achieving smaller size, higher capacitance, and improved reliability while minimizing moisture and plating solution penetration, especially when the dielectric and internal electrode thicknesses are reduced.
Innovation Solution
A multilayer electronic component design featuring a dielectric layer with internal electrodes, external electrodes, an insulating layer, and plating layers, where the ends of the plating and insulating layers have reduced thickness at their contact points to enhance adhesion and prevent moisture and plating solution penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the dielectric layer and internal electrode thicknesses are reduced to achieve smaller size and higher capacitance, then the capacitance per unit volume increases, but the margin becomes thinner and the component becomes vulnerable to penetration of external moisture or plating solution
Solution Approach 1:
The patent applies preliminary action by forming the insulating layer on the external electrode surface before final assembly and mounting. This insulating layer is applied in advance to seal the external electrode, preventing subsequent penetration of moisture or plating solution through the reduced margins of the thinned dielectric layer.
Solution Approach 2:
The insulating layer acts as an intermediary barrier between the external electrode and the external environment (moisture and plating solution). This intermediate protective layer prevents direct contact between harmful external substances and the vulnerable thinned dielectric structure, resolving the contradiction between reduced thickness and improved resistance.
2Area of stationary object
If the plating layer and glass layer are in contact over a large area, then coverage is improved, but the bonding force at the contact interface is reduced
Solution Approach 1:
The patent applies local quality by creating a thickness gradient in the insulating layer - the layer is thicker at the edges and thinner at the contact point with the plating layer. This localized variation in thickness provides both sufficient coverage area and optimal bonding conditions at the critical interface, resolving the contradiction between extensive coverage and strong bonding.
Solution Approach 2:
The patent changes the physical parameter of the insulating layer thickness to resolve the contradiction. By adjusting the thickness distribution (thinner at contact points, thicker at edges), the design achieves both adequate coverage area and strong bonding force at the plating-glass layer interface.
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.