MLCC Electrode Edge Cleaning for Side Margin Adhesion
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face issues such as partial side margin separation, short-circuit faults, and lower moisture resistance due to defects in the manufacturing process, particularly related to the exposure and adhesion of internal electrode edges during the sintering process.
Innovation Solution
A method involving the preparation of ceramic green sheets with internal electrode patterns, cross-stacking, cutting to expose electrode edges, applying an adhesive layer to remove foreign matter, and peeling it to prevent defects, while ensuring a low void ratio to enhance adhesion and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If internal electrodes are exposed from the body in the width direction with no margin to maximize effective electrode area, then capacitance per unit volume is increased, but side margin separation defects and short-circuit faults occur
Solution Approach 1:
A side margin is introduced as an intermediary component between the internal electrode and the external environment. This side margin extends from the end surface of the internal electrode along the width direction to the side surface of the body, acting as a protective mediator that prevents direct exposure of the electrode edge while maintaining electrical connection and structural integrity.
Solution Approach 2:
The side margin is formed in advance during the green sheet stacking process, before sintering. The side margin material is preliminarily positioned and bonded to the internal electrode and body structure, creating a pre-established protective framework that prevents separation defects during subsequent processing and operation.
2Reliability
If side margin is separately attached to the surface before sintering to prevent defects, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The side margin formation process is merged with the green sheet stacking process. Instead of separately attaching the side margin after body formation, the side margin is integrated into the stacking sequence, where green sheets containing side margin material are stacked alternately with internal electrode green sheets, combining multiple functions into a single manufacturing step.
Solution Approach 2:
The green sheet material serves multiple functions simultaneously: it provides the body structure, contains the internal electrode patterns, and incorporates the side margin material. This multi-functional green sheet design eliminates the need for separate side margin attachment processes, simplifying manufacturing while ensuring reliable adhesion.
3Productivity
If internal electrodes are maximally exposed to increase capacitance, then productivity is improved, but moisture resistance decreases
Solution Approach 1:
The side margin acts as a protective intermediary barrier between the internal electrode and the external environment. By extending from the end surface to the side surface, it creates a protective shield that blocks moisture penetration paths while allowing the electrode to remain maximally exposed for high capacitance, thus mediating between productivity and moisture resistance requirements.
Data Source
AI summary
A method for manufacturing a multilayer electronic component includes: preparing first ceramic green sheets on which first internal electrode patterns are formed spaced apart from each other and second ceramic green sheets on which second internal electrode patterns are formed spaced apart from each other; forming a ceramic green sheet stack by stacking the first ceramic green sheets and the second ceramic green sheets for the first internal electrode patterns and the second internal electrode patterns to be cross-stacked on each other; obtaining a multilayer body by cutting the ceramic green sheet stack to have a side surface to which distal edges of the first and second internal electrode patterns are exposed; adhering an adhesive layer to the side surface to which the distal edges of the first and second internal electrode patterns of the multilayer body are exposed; and peeling the adhesive layer from the side surface.