MLCC External Electrode Bulge Prevents Manhattan Phenomenon
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Solution Overview
Problem
Electronic components with conductive resin layers inside experience the 'Manhattan phenomenon' when mounted on circuit boards, where the uneven roundness of the external electrodes' surfaces causes solder to wet and spread unevenly, leading to component instability.
Innovation Solution
The electronic component design features external electrodes with a bulging part on the end face and a conductive resin layer that has a bulging part on its outer face, ensuring consistent solder wetting and spreading, preventing the Manhattan phenomenon.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer is applied to the external electrodes to mitigate thermal and mechanical impact, then the reliability of the electronic component is improved, but the roundness uniformity of the external electrode surface deteriorates
Solution Approach 1:
The patent applies different surface treatments to different regions of the external electrode. Specifically, the end face part receives a different treatment than the wraparound part, creating local quality differences. This allows the wraparound part to maintain its rounded surface for shock absorption while the end face part achieves uniform roundness for consistent solder wetting.
Solution Approach 2:
The external electrode surface is segmented into two distinct regions: the end face part and the wraparound part. Each region is treated differently to optimize its specific function. The end face part is treated for uniform solder wetting while the wraparound part maintains its natural rounded shape for mechanical protection.
2Strength
If the external electrode has a pronounced roundness on the wraparound part, then the shock absorption capability is improved, but the solder wetting and spreading uniformity deteriorates
Solution Approach 1:
Different surface characteristics are applied to different locations of the external electrode. The wraparound part maintains pronounced roundness for shock absorption, while the end face part achieves uniform roundness specifically for consistent solder wetting and spreading.
Solution Approach 2:
The surface parameters of the external electrode are changed locally. The end face part undergoes parameter changes to achieve uniform roundness, while the wraparound part maintains its original rounded parameters for mechanical cushioning.
3Reliability
If the molten solder wets and spreads easily on the end face part, then the electrical connection is improved, but the component stability deteriorates due to the Manhattan phenomenon
Solution Approach 1:
The patent creates an asymmetric distribution of surface properties on the external electrode. The end face part has uniform roundness for good solder wetting, while the wraparound part has pronounced roundness that prevents excessive solder spreading. This asymmetric design prevents the Manhattan phenomenon while maintaining good electrical connection.
Solution Approach 2:
The wraparound part's pronounced roundness acts as a preliminary barrier to prevent molten solder from spreading too far up the electrode. This preliminary anti-action counteracts the surface tension forces that would otherwise cause the component to stand up during soldering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the Manhattan phenomenon by ensuring uniform solder distribution across the external electrodes, enhancing the stability and reliability of the electronic component during mounting on circuit boards.
Implementation Method 1
The role of this conductive resin layer in the external electrodes is to mitigate any thermal or mechanical impact, if received, on the electronic component
Implementation Method 2
the molten solder easily wets and spreads over the outer face of the end face part
Implementation Method 3
the surface tension of the molten solder that has wetted and spread over the outer face of the end face part of the external electrode
Data Source
AI summary
In an exemplary embodiment, a multilayer ceramic capacitor has, at two opposing respective end parts of a capacitor body 11 of roughly rectangular solid shape, external electrodes 12 that each have a conductive resin layer F3 inside. Each of the external electrodes 12 continuously has an end face part 12a corresponding to one face, and a wraparound part 12b corresponding to four faces surrounding the one face, of the capacitor body 11. Also, the end face part 12a of each of the external electrodes 12 has a bulging part 12a1 on the outer face of the end face part 12a. An electronic component using the multilayer ceramic capacitor can maximally prevent the Manhattan phenomenon that may otherwise occur when the electronic component is mounted on a circuit board, even though its external electrodes have the conductive resin layer inside.