Multilayer Ceramic Capacitor Electrode Geometry for Chipping
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving high capacitance and reliability due to issues with electrode thickness ratios and sintering profiles, leading to defects such as chipping and poor external electrode application, which affect capacitance and reliability.
Innovation Solution
The multilayer ceramic electronic component is designed with specific electrode thickness ratios and sintering profiles, where the distance between internal electrode ends and the ceramic body's side surface (D1/D2) is between 0.5 to 0.95, and the central internal electrode thickness is greater than the cover portion electrode thickness, ensuring optimal capacitance and reliability by controlling the sintering process in multiple temperature sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal electrode thickness is increased to achieve high capacitance, then the capacitance increases, but the application of external electrodes becomes poor and chipping defects occur
Solution Approach 1:
The patent applies local quality by differentiating the internal electrode thickness across different regions of the ceramic body. The central portion has a greater electrode thickness (a) compared to the cover portion (b), with a specific ratio range (1.05≤a/b≤1.80). This local differentiation allows the central region to provide high capacitance while the cover region maintains better external electrode application quality and reduces chipping defects.
2Quantity of substance
If the internal electrode thickness ratio (a/b) is increased to improve capacitance, then the capacitance increases, but chipping defects increase and external electrode application deteriorates
Solution Approach 1:
The patent applies parameter changes by optimizing the internal electrode thickness ratio (a/b) within a specific range of 1.05 to 1.80. This controlled parameter adjustment ensures that the capacitance is maximized while preventing excessive thickness differentiation that would lead to chipping defects and poor external electrode application. The ratio represents a balanced optimization point.
3Quantity of substance
If the distance ratio D1/D2 is adjusted to optimize electrode distribution, then the capacitance distribution improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by defining specific distance ratios (D1/D2 between 0.5 to 0.95) for internal electrodes at different positions within the ceramic body. The central portion electrodes have different spacing characteristics compared to cover portion electrodes, allowing optimized capacitance distribution while maintaining manufacturability through clear geometric specifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the application of external electrodes, reduces chipping defects, and achieves the target capacitance, providing a high-capacity and reliable multilayer ceramic capacitor with improved connectivity and reduced sintering-related issues.
Implementation Method 1
the multilayer ceramic electronic component is designed with specific electrode thickness ratios and sintering profiles, where the distance between internal electrode ends and the ceramic body's side surface (D1/D2) is between 0.5 to 0.95
Data Source
AI summary
There is provided a multilayer ceramic electronic component including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed in the ceramic body, having at least one of the dielectric layers interposed therebetween, wherein when a distance between a widthwise end of an internal electrode disposed at a central portion of the ceramic body in a thickness direction thereof and an adjacent side surface of the ceramic body is defined as D1 and a distance between a widthwise end of an internal electrode disposed at an upper or lower portion of the ceramic body in the thickness direction thereof and the adjacent side surface of the ceramic body is defined as D2, D1/D2 is in a range of 0.5 to 0.95 (0.5≦D1/D2≦0.95).