Multi-Layer Ceramic Component Electrode Concave Region Design
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Solution Overview
Problem
Miniaturization of electronic devices has made multi-layer ceramic electronic components more prone to the Manhattan phenomenon, where they rise due to solder surface tension, and deepening the ceramic sintered body's concave surface to prevent this can lead to structural defects like cracks.
Innovation Solution
A multi-layer ceramic electronic component design featuring a ceramic body with specifically configured external electrodes, including concave regions on the electrode end surfaces, where the ratio of the concave region's length to the peripheral region's length is between 0.004 and 0.025, allowing solder accumulation and preventing electrode floating, while maintaining a gentle shape to avoid edge protrusions and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the concave surface of the ceramic sintered body is deepened to prevent the Manhattan phenomenon, then the Manhattan phenomenon is prevented, but the peripheral edge of the end surface protrudes resulting in structural defects such as cracks
Solution Approach 1:
The invention applies local quality by creating a concave region only in the central area of the electrode end surface, while maintaining a flat peripheral edge region. This localized concavity allows solder accumulation to prevent the Manhattan phenomenon without causing peripheral edge protrusion that would lead to cracks. The concave region has different geometric properties (depth and area ratio) than the peripheral region, optimizing both solder retention and structural integrity.
Solution Approach 2:
The invention changes the geometric parameters of the electrode end surface by defining a concave region with specific dimensional relationships. The parameter b/a (where b is the depth of the concave region and a is half the width of the peripheral region) is controlled to be 0.004 or more and 0.025 or less. This parameter optimization ensures sufficient solder accumulation capability while preventing excessive depth that would cause peripheral edge protrusion and structural defects.
2Volume of moving object
If miniaturization is pursued to reduce device size, then device size is reduced, but the Manhattan phenomenon becomes more likely to occur
Solution Approach 1:
The invention applies preliminary action by pre-forming a concave region in the electrode end surface before soldering. This pre-prepared geometry creates a solder trap that proactively prevents the Manhattan phenomenon by directing solder flow into the concave region during the soldering process. This preliminary structural preparation ensures reliable solder joint formation even in miniaturized components where the Manhattan phenomenon is more prone to occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents the Manhattan phenomenon and structural defects such as cracks, ensuring reliable mounting and improved environmental resistance of the ceramic body.
Implementation Method 1
the electrode end surface includes a concave region, allowing solder to accumulate in the concave region, thereby preventing the Manhattan phenomenon
Implementation Method 2
a so-called Manhattan phenomenon (Tombstone phenomenon) in which the multi-layer ceramic capacitor rises due to the surface tension of the pair of solders occurs in some cases
Data Source
AI summary
A multi-layer ceramic electronic component includes: a ceramic body including a first end surface and a second end surface facing in a direction of a first axis, and internal electrodes laminated in a direction of a second axis orthogonal to the first axis and drawn from the first end surface or the second end surface; a first external electrode disposed to cover the first end surface; and a second external electrode disposed to cover the second end surface. Each of the first external electrode and the second external electrode has an electrode end surface facing in the direction of the first axis. The electrode end surface includes a pair of first peripheral regions located at peripheral edges in the direction of the second axis, and a first concave region located between the pair of first peripheral regions and recessed from the pair of first peripheral regions.