Multilayer Ceramic Capacitor Electrode Connectivity Optimization
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Solution Overview
Problem
The challenge in manufacturing high capacitance multilayer ceramic electronic components is the reduced thickness of internal electrodes, which affects connectivity and reliability, making it difficult to achieve both high capacitance and miniaturization while preventing connectivity issues and thermal stress-related cracking.
Innovation Solution
The solution involves forming internal electrodes with a thickness between 0.1 μm to 1.0 μm and optimizing their connectivity by adjusting the ratio of edge region to central region connectivity within specific ranges, using a conductive paste with a controlled ceramic to metal powder particle size ratio, and sintering processes to ensure reliable high capacitance and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of internal electrodes is reduced to achieve miniaturization and high capacitance, then the capacitance density increases and device size decreases, but the connectivity of internal electrodes deteriorates and reliability decreases
Solution Approach 1:
The patent applies local quality by differentiating the treatment of edge regions versus central regions of internal electrodes. Edge regions are specifically targeted with optimized conductive paste formulation and sintering conditions to maintain connectivity (S≥75%) while central regions focus on capacitance formation. This localized approach allows thin electrode design without compromising overall reliability.
Solution Approach 2:
The patent utilizes parameter changes by precisely controlling the thickness of internal electrodes (0.1-1.0 μm) and dielectric layers (≤2.0 μm), adjusting the connectivity parameter S to be within 75-98%, and controlling the ratio of edge region connectivity to central region connectivity (0.9-0.98). These parameter optimizations enable both miniaturization and maintained reliability.
2Quantity of substance
If the thickness of internal electrodes is reduced to achieve high capacitance, then the capacitance per unit volume increases, but thermal stress-related cracking occurs and reliability deteriorates
Solution Approach 1:
The patent applies beforehand cushioning by pre-optimizing the conductive paste formulation with specific metal powder (Ni, Cu, or Pd) and ceramic powder ratios, and controlling particle size distributions before sintering. This preparatory optimization creates a buffer against thermal stress during subsequent processing and operation, preventing cracking in thin electrodes while maintaining high capacitance.
Solution Approach 2:
The patent uses composite materials in the conductive paste formulation, combining metal powders (Ni, Cu, or Pd) with ceramic powders in specific ratios. This composite structure provides both electrical conductivity and mechanical strength to thin internal electrodes, preventing thermal stress cracking while enabling high capacitance density.
3Volume of moving object
If the thickness of dielectric layers is reduced to achieve miniaturization, then the device size and weight decrease, but the connectivity and capacitance stability deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling dielectric layer thickness (≤2.0 μm) and optimizing the composition of dielectric materials (BaTiO3, SrTiO3, Pb(Zr,Ti)O3). These parameter optimizations maintain capacitance stability despite reduced thickness, enabling miniaturization without sacrificing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of high capacitance multilayer ceramic capacitors with improved reliability and reduced thickness, effectively addressing connectivity and thermal stress issues while maintaining desired capacitance levels.
Implementation Method 1
sintering processes to ensure reliable high capacitance and prevent cracking
Data Source
AI summary
There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 μm≦Te≦1.0 μm, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%≦S≦98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98.