Multilayer Ceramic Component External Electrodes With Corner Holes
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Solution Overview
Problem
As multilayer ceramic electronic components miniaturize, the decreasing thickness of external electrodes compromises their reliability and durability, leading to issues with waterproof reliability and mounting defects.
Innovation Solution
Optimizing the number and placement of holes in the plating and base electrode layers of the external electrodes to cover at least five of the eight corners of the ceramic body, with one to three holes adjacent to each corner, to maintain reliability and durability while reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of external electrodes is decreased to enable miniaturization, then the size of the multilayer ceramic electronic component is reduced, but the reliability and durability of the external electrode deteriorate
Solution Approach 1:
The patent applies local quality by creating holes at specific locations (corner regions) of the external electrode rather than uniformly throughout. This localized modification allows the electrode to maintain sufficient material thickness in critical areas while reducing overall thickness for miniaturization, thereby preserving reliability and durability where most needed while achieving size reduction.
Solution Approach 2:
The patent introduces a porous structure (holes) into the external electrode at corner regions. This porous modification reduces the overall material quantity and enables miniaturization while the strategic placement of holes maintains structural integrity and reliability in critical load-bearing areas, resolving the contradiction between size reduction and reliability maintenance.
2Volume of moving object
If the thickness of external electrodes is decreased, then miniaturization is achieved, but waterproof reliability deteriorates
Solution Approach 1:
The patent applies local quality by concentrating holes in corner regions of the external electrode rather than distributing them uniformly. This localized approach maintains continuous material coverage in critical edge and surface areas that are most vulnerable to moisture ingress, thereby preserving waterproof reliability while enabling overall thickness reduction for miniaturization.
Solution Approach 2:
The patent converts the potential harm of thin electrodes (which could allow moisture penetration) into a beneficial controlled porous structure. By strategically placing holes in corner regions, the design actually improves moisture management by directing potential moisture pathways away from critical interfaces, thereby maintaining waterproof reliability while achieving miniaturization.
3Volume of moving object
If the thickness of external electrodes is decreased, then miniaturization is achieved, but mounting defective rate increases
Solution Approach 1:
The patent applies local quality by placing holes specifically in corner regions of the external electrode, leaving the central and edge mounting areas with continuous, uniform material thickness. This ensures that mounting surfaces maintain sufficient material integrity for reliable soldering and attachment, thereby reducing mounting defective rates while still enabling overall miniaturization through localized thinning.
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.