MLCC Internal Electrode Disconnections for Delamination Resistance
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Solution Overview
Problem
The miniaturization and high capacitance requirements of multilayer ceramic capacitors lead to increased boundaries between dielectric layers and internal electrodes, resulting in low bonding strength, vulnerability to delamination and cracking, and degraded humidity resistance reliability.
Innovation Solution
Incorporating disconnected portions within internal electrodes that include pores or dielectric substances to connect adjacent dielectric layers, with a dielectric filling ratio between 20% to 80%, to enhance bonding force and reliability, while maintaining miniaturization and high capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dielectric layer and internal electrode are thinned to increase the number of laminated layers, then miniaturization and high capacitance are achieved, but the bonding strength between heterogeneous materials decreases and the component becomes vulnerable to delamination and cracking
Solution Approach 1:
A buffer layer is introduced between the internal electrode and dielectric layer to act as an intermediary material. This buffer layer has intermediate properties between metal and ceramic, reducing thermal stress and improving bonding strength at the heterogeneous interface, thereby preventing delamination and cracking while maintaining thin-layer miniaturization
Solution Approach 2:
The internal electrode structure is designed as a composite material system comprising a metal base layer, an intermediate buffer layer, and an oxidized surface layer. This multi-layer composite structure combines the advantages of different materials to achieve both mechanical strength and electrical conductivity while reducing stress concentration
2Volume of moving object
If the dielectric layer and internal electrode are thinned to increase the number of laminated layers, then miniaturization and high capacitance are achieved, but the component becomes vulnerable to delamination and cracking
Solution Approach 1:
The buffer layer serves as a protective intermediary that prevents direct contact between the metal internal electrode and the ceramic dielectric layer, reducing the risk of humidity-induced degradation and improving long-term reliability in humid environments
Solution Approach 2:
The buffer layer is pre-formed between the electrode and dielectric before final assembly, providing advance protection against potential delamination and cracking that could occur during operation or under humidity stress
3Quantity of substance
If the number of laminated layers is increased by thinning the dielectric layer and internal electrode, then high capacitance is achieved, but the number of boundaries between dielectric layers and internal electrodes increases, degrading bonding strength
Solution Approach 1:
The internal electrode is segmented into multiple thin layers with buffer layers inserted between them. This segmentation reduces the thickness of each individual electrode-dielectric interface, lowering stress concentration and improving bonding strength at each boundary while maintaining the overall high capacitance through increased layer count
Data Source
AI summary
A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.