Multilayer Ceramic Capacitor Electrode Glass Control
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Solution Overview
Problem
The miniaturization of electronic products has led to increased demand for small multilayer ceramic electronic components with high capacitance, but the thinning of external electrodes makes it challenging to achieve effective chip sealing and reliability due to issues with glass content, leading to potential plating defects and permeation of plating solutions.
Innovation Solution
A multilayer ceramic electronic component design with a ceramic body, internal electrodes, and external electrodes that include a conductive metal and glass portions, where the average thickness of the glass portions is controlled to be 10 μm or less, and the glass particles have an average diameter of 2 μm or less, ensuring uniform distribution and preventing plating solution permeation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the external electrode is thinned to achieve miniaturization, then the size of the electronic component is reduced, but the reliability deteriorates due to increased permeation risk and difficulty in achieving desired compactness
Solution Approach 1:
The patent applies local quality by creating an irregular external electrode shape with varying thickness - thinner at the center for miniaturization and thicker at the edges for reliability. This local differentiation allows the electrode to simultaneously achieve small overall size while maintaining sufficient thickness in critical areas to prevent plating solution permeation.
2Reliability
If the glass content in external electrode paste is increased to enhance chip sealing properties, then the sealing effectiveness is improved, but plating defects occur due to glass elution to the surface
Solution Approach 1:
The patent applies parameter changes by precisely controlling the glass content within 5-15 wt% of the external electrode paste and limiting glass particle size to 10 μm or less. This parameter optimization ensures sufficient glass for chip sealing while preventing excessive glass that would cause elution and plating defects.
Solution Approach 2:
The patent uses composite materials by combining conductive metal (such as copper) with controlled amounts of glass particles in the external electrode paste. This composite structure provides both electrical conductivity and chip sealing properties while the controlled glass content prevents harmful elution during plating.
3Object-generated harmful factors
If the glass content in external electrode paste is insufficient, then plating defects are avoided, but chip sealing properties become ineffective
Solution Approach 1:
The patent applies parameter changes by establishing a minimum glass content threshold of 5 wt% in the external electrode paste. This ensures sufficient glass is present to provide effective chip sealing properties while staying below the threshold that would cause excessive elution and plating defects.
Data Source
AI summary
There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls≦10 μm is satisfied.