Low-Profile Multilayer Ceramic Capacitor Electrode Layout for Mountability
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Solution Overview
Problem
Existing low-profile multilayer ceramic capacitors face a challenge in maintaining mountability during mounting, as outer electrodes are not disposed on the main surfaces facing away from each other in the lamination direction, which degrades mountability.
Innovation Solution
A multilayer ceramic capacitor design with outer electrodes on the main surfaces and end surfaces, utilizing direct plating layers and main surface electrodes to reduce the lamination direction thickness without compromising mountability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If outer electrodes are not disposed on the main surfaces to achieve lower profile, then the lamination direction dimension is reduced, but mountability during mounting degrades
Solution Approach 1:
The outer electrodes are configured to extend not only on the main surfaces but also onto the side surfaces of the multilayer body. This dimensional extension provides additional mounting surfaces and improves mountability while maintaining the reduced profile in the lamination direction, as the electrodes utilize the side surface area to compensate for the reduced main surface presence.
Solution Approach 2:
The outer electrodes are divided into multiple plating layers including direct plating layers, main surface electrodes, upper plating layers, and front plating layers. This segmentation allows each layer to serve specific functions: direct plating layers provide electrical connection, main surface electrodes provide mounting surfaces, and front plating layers enhance solderability, collectively resolving the mountability issue while maintaining low profile.
2Length of moving object
If outer electrodes are not disposed on the main surfaces to achieve lower profile, then the lamination direction dimension is reduced, but electrical connection reliability may worsen
Solution Approach 1:
The outer electrodes extend onto the side surfaces of the multilayer body, providing additional contact areas for electrical connection. This dimensional extension ensures reliable electrical connection while maintaining the reduced lamination direction dimension, as the side surface extension compensates for the reduced main surface presence.
Solution Approach 2:
The outer electrodes comprise composite structures with multiple plating layers including direct plating layers, main surface electrodes, upper plating layers, and front plating layers. Each layer contributes different properties: direct plating layers provide electrical connection, main surface electrodes provide mechanical support, and front plating layers provide solderability, collectively ensuring both low profile and reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a low-profile ceramic capacitor with reduced dimensions in the lamination direction without degrading mountability during mounting, ensuring mountability during mounting.
Implementation Method 1
the first outer electrode includes a first direct plating layer covering the first end surface
Data Source
AI summary
A multilayer ceramic capacitor includes a multilayer body and first and second outer electrodes. The first outer electrode includes a first direct plating layer covering the first end surface, a first main surface electrode covering at least a portion of the first main surface, a first upper plating layer, and a first front plating layer, and the second outer electrode includes a second direct plating layer covering a second end surface, a second main surface electrode covering at least a portion of the second main surface, a second upper plating layer, and a second front plating layer.