Multilayer Ceramic Capacitor Electrode Offset for Short Circuit Prevention
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in maximizing capacitance while preventing short circuits between internal electrode patterns, particularly during manufacturing processes that involve stacking and cutting of dielectric sheets.
Innovation Solution
The solution involves alternately stacking internal electrode patterns with rectangular strip shapes in a vertical direction, offsetting them horizontally to ensure maximum overlap and exposure on specific outer surfaces, with side parts strategically placed to prevent physical or chemical stress and potential short circuits, and using a method of forming ceramic green sheets with dielectric material and internal electrode base patterns to create a multilayer structure with optimized external and internal electrode connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked dielectric sheets is increased to enhance capacitance, then the capacitance value is improved, but the risk of short circuits between internal electrode patterns increases
Solution Approach 1:
The patent applies segmentation by dividing the internal electrode patterns into distinct first and second patterns that are alternately stacked and offset from each other. This segmentation creates physical separation between electrode patterns of the same polarity, reducing the risk of short circuits while maintaining high capacitance through increased stacking density.
Solution Approach 2:
The patent employs asymmetry by offsetting the first and second internal electrode patterns horizontally relative to each other in the vertical stacking direction. This asymmetric arrangement ensures that electrode patterns do not align perfectly, creating natural spacing that prevents short circuits while maximizing the overlapping area for capacitance generation.
2Quantity of substance
If internal electrode patterns are offset horizontally to maximize overlapping area, then capacitance is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by creating different spatial arrangements for first and second internal electrode patterns at different locations within the multilayer structure. The offset arrangement is specifically implemented where needed to maximize overlapping area, while maintaining manufacturing feasibility through consistent local patterns that can be replicated during production.
3Volume of moving object
If dielectric sheets are slimmed to increase stacking density, then component miniaturization is achieved, but structural stability and short circuit prevention become more difficult
Solution Approach 1:
The patent applies dimensionality change by transitioning from a single-plane electrode arrangement to a three-dimensional alternately stacked configuration with horizontal offsets. This spatial reorganization in multiple dimensions allows for increased stacking density and miniaturization while the offset arrangement in the horizontal dimension provides inherent short circuit prevention.
Data Source
AI summary
A multilayer electronic component includes a body, first and second external electrodes, and first and second side parts. The body includes a multilayer structure in which first and second internal electrode patterns are alternately stacked and contains a dielectric material. The first and second side parts are disposed on outer surfaces of the body to face each other. The first and second external electrodes are disposed on outer surfaces of the body to face each other. The first internal electrode patterns are exposed to a third surface and a fifth surface of the body on which the first external electrode and the first side part are disposed, respectively. Additionally, the second internal electrode patterns are exposed to a fourth surface and a sixth surface of the body on which the second external electrode and the second side part are disposed, respectively.