Multilayer Ceramic Capacitor Electrode Openings for Stable Solder Mounting
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Solution Overview
Problem
Multilayer ceramic capacitors with LW reversed configuration face issues with self-alignment and mountability due to variations in the area and shape of the covering portion, leading to potential tilting and short-circuit failures during soldering, especially with increased mounting density on board.
Innovation Solution
The design includes a multilayer ceramic capacitor with a specific dimensional relationship (w>l>t) and external electrodes featuring opening portions that expose the multilayer body surface, allowing for improved solder wetting and dispersion, which enhances self-alignment and prevents tilting or short-circuit failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the covering portion area and shape are reduced due to base conductor layer and covering conductor layer variations, then the manufacturing complexity is reduced, but the self-alignment effect deteriorates and mountability worsens
Solution Approach 1:
The patent applies preliminary action by forming the covering portion with a predetermined area and shape before the soldering process. The covering portion is designed in advance with specific dimensions (e.g., 0.03mm² to 0.10mm²) and shape characteristics that ensure proper solder wetting and self-alignment. This pre-established covering portion compensates for potential variations in base conductor layer and covering conductor layer formation, maintaining reliable self-alignment effect without increasing manufacturing complexity.
2Productivity
If the multilayer ceramic capacitor is made thinner to reduce height for LSC type mounting, then the mounting density increases, but the structural stability and solder joint reliability may deteriorate
Solution Approach 1:
The patent applies parameter changes by optimizing the covering portion area within a specific range (0.03mm² to 0.10mm²) and controlling its shape characteristics. By adjusting these parameters, the invention achieves reliable solder joint formation even on thin multilayer ceramic capacitors designed for LSC type mounting. The covering portion parameters are carefully selected to ensure sufficient solder wetting area while maintaining the reduced height profile required for high mounting density applications.
3Productivity
If the lands on the mounting board are placed at short distances to increase mounting density, then the productivity increases, but the self-alignment effect deteriorates and short-circuit failures may occur
Solution Approach 1:
The patent applies local quality by creating a covering portion with specific area and shape characteristics at the soldering location. This localized feature ensures proper solder wetting and self-alignment even when lands are placed at short distances. The covering portion's predetermined dimensions (0.03mm² to 0.10mm²) and shape are optimized to maintain reliable solder joint formation and prevent short-circuit failures, enabling high mounting density without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the mounting of multilayer ceramic capacitors by improving self-alignment and reducing the risk of tilting or short-circuit failures, ensuring reliable attachment and performance even at high mounting densities.
Implementation Method 1
external electrodes featuring opening portions that expose the multilayer body surface, allowing for improved solder wetting and dispersion
Data Source
AI summary
In a multilayer ceramic capacitor, when a dimension in a length direction between a first end surface and a second end surface of a multilayer body is defined as l, a dimension in a width direction between a first lateral surface and a second lateral surface of the multilayer body is defined as w, and a dimension in a height direction between a first main surface and a second main surface of the multilayer body is defined as t, a dimensional relationship of w>l>t is satisfied, and a fourth surface portion and a fifth surface portion of the first external electrode, and a ninth surface portion and a tenth surface portion of the second external electrode each include an opening portion at which a surface of the multilayer body is exposed.