Multilayer Ceramic Component External Electrode Paste
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in achieving high reliability due to issues with external electrode densification and adhesion to internal electrodes, as well as increased contact resistance, which affects electrical properties.
Innovation Solution
A paste for external electrodes containing a conductive metal, conductive ceramic powder, and glass component is used, with the conductive ceramic powder present in an amount of 3 wt % to 20 wt %, to form sintered external electrodes that reduce contact resistance and enhance adhesion, while the glass component aids in densification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional paste formulations are used for external electrodes, then manufacturing simplicity is maintained, but contact resistance between internal electrode and external electrode increases
Solution Approach 1:
The patent applies composite materials by formulating the external electrode paste with multiple conductive components including conductive metal powder (silver, copper, or nickel), conductive ceramic powder (barium titanate, strontium titanate, or lead zirconate titanate), and glass frit in specific weight ratios. This composite formulation reduces contact resistance between internal and external electrodes while maintaining manufacturing feasibility through established paste application processes.
2Reliability
If external electrode paste contains insufficient conductive ceramic powder, then paste application is simpler, but adhesion between external electrode and internal electrode deteriorates
Solution Approach 1:
The patent applies parameter changes by optimizing the weight ratio of conductive ceramic powder to conductive metal powder within specific ranges (conductive ceramic powder: 1-20 wt%, conductive metal powder: 80-99 wt%). This parameter optimization enhances adhesion strength between external electrodes and internal electrodes while maintaining paste applicability through conventional manufacturing methods.
3Reliability
If sintering temperature is increased to improve densification, then electrode density improves, but risk of internal electrode oxidation increases
Solution Approach 1:
The patent applies the intermediary principle by introducing glass frit (10-50 wt%) as a mediator in the external electrode paste formulation. The glass frit facilitates densification of the external electrode during sintering while forming a protective barrier that prevents oxidation of internal electrodes, thus enabling achievement of both high densification and oxidation protection through controlled sintering processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decreases contact resistance and prevents delamination, ensuring high reliability and electrical performance of multilayer ceramic electronic components by optimizing the sintering process and adhesion properties.
Implementation Method 1
forming external electrodes by sintering the paste for an external electrode
Implementation Method 2
the glass component aids in densification
Implementation Method 3
adhesion properties with respect to internal electrodes
Data Source
AI summary
A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; internal electrodes disposed in the ceramic body and having one ends exposed to outer surfaces of the ceramic body; and external electrodes disposed on the outer surfaces of the ceramic body to be connected to the respective one ends of the internal electrodes and containing a conductive metal and a conductive ceramic powder.