MLCC External Electrode Structure for Plating Penetration Resistance
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face challenges in achieving higher capacitance per unit volume, reliability, and smaller size while minimizing the risk of moisture and plating solution penetration, which can compromise their performance and durability.
Innovation Solution
The proposed multilayer electronic component includes a body with dielectric layers and alternately disposed internal electrodes, external electrodes with specific band and connection portions, an insulating layer covering the connection portions and band portions, and plating layers on the band portions to enhance reliability and prevent moisture and plating solution penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacks is increased to achieve higher capacitance and smaller size, then capacitance per unit volume is improved, but the margin becomes thinner and vulnerability to moisture and plating solution penetration increases
Solution Approach 1:
The patent applies preliminary action by forming the insulating layer covering the external electrodes and band portions before final assembly and mounting. This pre-formed protective barrier prevents moisture and plating solution from reaching internal electrodes during subsequent manufacturing and service processes, addressing reliability concerns before they can manifest.
Solution Approach 2:
The insulating layer acts as an intermediary barrier between the external electrodes/band portions and the harmful environment (moisture and plating solution). This intermediate protective layer prevents direct contact between conductive elements and harmful substances, resolving the contradiction between increased integration and improved reliability.
2Quantity of substance
If internal electrodes and dielectric layers are made thinner to increase the number of stacks, then capacitance per unit volume is improved, but reliability decreases due to thinner margins
Solution Approach 1:
The patent shifts the protective function from the vertical dimension (thicker dielectric layers and margins within the body) to the horizontal dimension (insulating layer covering external surfaces and band portions). This dimensional transition allows thin internal structures to maintain high capacitance while external protection prevents penetration pathways.
Solution Approach 2:
By pre-forming the insulating layer on external surfaces before mounting and plating processes, the patent establishes protection against moisture and plating solution penetration in advance, compensating for the reduced protective capacity of thinner internal margins.
3Ease of operation
If band portions are extended onto the first and second surfaces, then external electrode connectivity is improved, but space for mounting is reduced
Solution Approach 1:
The insulating layer functions as a thin film that covers the band portions extended onto the first and second surfaces. This thin protective film provides necessary insulation and protection while occupying minimal space, allowing band portions to extend for improved connectivity without significantly reducing mounting area.
4Reliability
If the insulating layer covers the second surface and third and fourth band portions, then protection against penetration is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the insulating layer formation with the existing external electrode and band portion structure. By integrating the insulating layer as a unified protective covering that simultaneously protects multiple surfaces and band portions, the design achieves comprehensive protection without proportionally increasing manufacturing complexity.
Data Source
AI summary
An electronic component includes: a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a connection portion on the third surface, and first and third band portions respectively on the first and second surfaces; a second external electrode including a connection portion on the fourth surface, and second and fourth band portions respectively on the first and second surfaces; an insulating layer disposed on the connection portions, and covering the second surface and the third and fourth band portions; plating layers respectively disposed on the first and second band portions; and first and second additional electrode layers respectively disposed between the connection portion and the third surface and between the connection portion and the fourth surface. The first or second external electrode includes copper. The first or second additional electrode layer includes one of nickel and an alloy of nickel.