Multilayer Ceramic Capacitor Electrode Design for Low ESR

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Solution Overview

Problem

Multilayer ceramic capacitors face issues with high equivalent series resistance (ESR) due to the inclusion of conductive epoxy-based thermosetting resin layers, which also increase the risk of crack generation under mechanical and thermal stress, particularly in harsh environments.

Innovation Solution

The design incorporates a conductive resin layer with a thermosetting resin and metal component between the base electrode layer and plating layer, ensuring direct contact between the base electrode layer and plating layer at specific corners and edges, reducing ESR and enhancing mechanical flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive epoxy-based thermosetting resin layer is used for outer electrodes to reduce crack generation under stress, then reliability is improved, but equivalent series resistance becomes excessively high

Engineering Contradiction:
Improvecrack resistanceVSAvoidequivalent series resistance
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The outer electrode is divided into two distinct layers: a conductive resin layer for shock absorption and a low-resistance metal plating layer for electrical conduction. This segmentation allows each layer to specialize in its respective function, resolving the contradiction between crack resistance and low ESR.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The outer electrode uses a composite structure combining conductive resin (for mechanical flexibility and crack resistance) with metal plating (for low electrical resistance). This composite approach integrates the advantages of both materials to simultaneously achieve reliability and low energy loss.

Inventive Principle:
Principle #40Composite materials

2Reliability

If a conductive resin layer is added to the outer electrode structure to improve shock resistance, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveshock resistanceVSAvoidelectrode structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The electrode structure is segmented into functional layers with the conductive resin layer positioned between the base electrode and plating layer. This clear segmentation simplifies the manufacturing process and structure design while achieving improved shock resistance.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces equivalent series resistance and minimizes crack generation in ceramic capacitors, improving their performance and reliability in severe environments by acting as a shock-absorbing layer.

Implementation Method 1

a first conductive resin layer including a thermosetting resin and a metal component disposed on the first base electrode layer... acting as a shock-absorbing layer

Methodology Applied
Scientific EffectShock absorption: Damping

Implementation Method 2

a first conductive resin layer including a thermosetting resin and a metal component... significantly reduces equivalent series resistance

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10062514B2Multilayer ceramic capacitor
Publication Date: 2018.08.28 MURATA MFG CO LTD
  • US10062514B2 patent drawing
  • US10062514B2 patent drawing
  • US10062514B2 patent drawing

AI summary

In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.