Multilayer Ceramic Capacitor Electrode Extensions for Crack Suppression
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Solution Overview
Problem
Ceramic electronic devices with low height structures are prone to cracking, which degrades their transverse intensity, a critical issue in the miniaturization of electronic components like multilayer ceramic capacitors.
Innovation Solution
The design incorporates external electrodes with extension portions along the sides of the ceramic chip, which enhance the structural integrity by distributing stress and preventing crack formation, thereby improving the transverse strength of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the ceramic electronic device is downsized and thinned to reduce height, then the device size and thickness are reduced, but the transverse intensity is degraded due to crack occurrence
Solution Approach 1:
The external electrodes are extended along the side surfaces of the ceramic chip in the thickness direction, adding a vertical dimension to the electrode structure. This dimensional extension allows the electrodes to provide mechanical support and distribute stress throughout the thickness of the device, thereby improving transverse intensity without increasing the overall device footprint.
Solution Approach 2:
The external electrodes are divided into multiple segments: a base portion on the main surface and extension portions along the side surfaces. This segmentation allows each portion to perform specific functions - the base portion provides electrical connection while the extension portions provide mechanical reinforcement and stress distribution, collectively preventing crack propagation.
2Area of stationary object
If the ceramic electronic device is downsized to reduce area, then the device area is reduced, but the transverse intensity is degraded due to crack occurrence
Solution Approach 1:
By extending electrodes along the side surfaces in the thickness direction, the invention compensates for the reduced planar area by utilizing the vertical dimension. This creates additional structural support that maintains transverse intensity despite the smaller overall device area.
Solution Approach 2:
The extension portions of the external electrodes are strategically positioned along the side surfaces where stress concentration is most likely to occur. This localized reinforcement provides targeted strength enhancement at critical regions without requiring a increase in overall device area.
Data Source
AI summary
A ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers that are stacked, and having a first main face and a second main face, and a plurality of external electrodes, the plurality of external electrodes being spaced from each other, each of the plurality of external electrodes being connected to a part of the plurality of internal electrode layers, the plurality of external electrodes having a predetermined area in the planar view. On at least one of the first main face and the second main face, at least one of the plurality of external electrodes has an extension portion extending along a side of the rectangular shape toward at least one of external electrodes adjacent to the at least one of the plurality of external electrodes.