MLCC Electrode Layout for Stress Relief at Overlap Corners
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Solution Overview
Problem
The concentration of stress due to electrostriction in the corners where electrode patterns of different polarities overlap in the stacking direction of internal electrodes in multilayer ceramic capacitors (MLCCs) leads to reduced reliability and breakdown voltage (BDV) characteristics, especially under high voltage conditions.
Innovation Solution
A multilayer electronic component design with specific electrode pattern configurations, including main and auxiliary portions spaced apart in the third direction, distributes electric fields to offset stress concentrations, enhancing reliability by controlling the shape of electrode patterns and alleviating stress at overlapping corners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a floating electrode layer is introduced to distribute voltage, then stress concentration is alleviated to some extent, but stress still concentrates in corners where electrode patterns of different polarities overlap, deteriorating BDV characteristics and reliability
Solution Approach 1:
The electrode patterns are segmented into main portions and auxiliary portions spaced apart in the third direction. This segmentation prevents continuous overlap at corners, distributing the electrostriction stress more evenly across multiple separated regions rather than concentrating it at single corner points, thereby improving BDV characteristics while maintaining the floating electrode layer structure.
Solution Approach 2:
The auxiliary portions are strategically positioned at locations where stress concentration is most problematic (corners with overlapping electrode patterns of different polarities). By modifying the local electrode configuration at these critical regions while maintaining standard patterns elsewhere, the invention targets stress relief precisely where needed without compromising overall capacitor performance.
2Reliability
If electrode patterns are modified to alleviate stress concentration, then reliability improves, but device complexity increases due to additional auxiliary portions
Solution Approach 1:
The electrode patterns are segmented into main portions and auxiliary portions spaced apart in the third direction. This segmentation prevents continuous overlap at corners, distributing the electrostriction stress more evenly across multiple separated regions rather than concentrating it at single corner points, thereby improving BDV characteristics while maintaining the floating electrode layer structure.
Solution Approach 2:
The auxiliary portions are integrated into the existing floating electrode layer structure, combining stress relief functionality with the voltage distribution function already provided by the floating electrode layer. This merging approach allows the electrode pattern to perform multiple functions simultaneously without requiring separate additional components or structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design improves the reliability and BDV characteristics of MLCCs by distributing stress evenly across the electrode patterns, reducing the concentration of stress at critical overlap regions, thereby enhancing their performance under high voltage conditions.
Implementation Method 1
When voltage is applied to a multilayer ceramic capacitor, stress may occur inside the multilayer ceramic capacitor due to an electrostriction phenomenon of a dielectric layer
Data Source
AI summary
A multilayer electronic component according to an example embodiment of the present disclosure may allow an electric field formed in a first direction between an internal electrode layer and a floating electrode layer to be formed in a second direction or a third direction to offset stress formed in a stress concentration region, thereby improving reliability, including BDV characteristics, of the multilayer electronic component.